Temperature-controlled camera assembly

ABSTRACT

The various implementations described herein include a video camera assembly that includes: (1) a housing; (2) an image sensor encased in the housing and configured to capture activity of the smart home environment; (3) a wireless radio configured to transmit video frames captured by the image sensor to an electronic device via a remote server; (4) at least one infrared transmitter configured to selectively illuminate the smart home environment; (5) one or more circuit boards encased in the housing, the one or more circuit boards including at least one processor mounted thereon; and (6) a heating component coupled to the image sensor, the heating component configured to continuously maintain the image sensor at a temperature above a threshold temperature while the image sensor is capturing the activity of the smart home environment.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/560,611, filed Sep. 19, 2017, which is hereby incorporated byreference in its entirety.

This application is related to U.S. application Ser. No. 15/710,770,filed Sep. 20, 2017, entitled “Camera Assembly with Concave-Shaped FrontFace,” U.S. patent application Ser. No. 15/710,758, filed Sep. 20, 2017,entitled “Mount Hinge for an Electronic Device,” and U.S. patentapplication Ser. No. 15/710,765, filed Sep. 20, 2017, entitled “MountAttachment for an Electronic Device,” each of which is herebyincorporated by reference in its entirety.

TECHNICAL FIELD

This relates generally to camera assemblies, including but not limitedto, temperature-controlled video camera assemblies.

BACKGROUND

Video surveillance cameras are used extensively. Usage of video camerasin residential and commercial environments has increased substantially,in part due to lower prices and simplicity of deployment.

As consumer demands change and the complexity of home automation andrelated systems increases, various new challenges, such as temperatureand illumination management, arise in designing such camera products.These challenges are particularly important for outdoor products thattend to be exposed to larger temperature shifts and environmentalconditions. For example, cameras having fixed-focus image sensorsrequire that the operating temperature be within a particular range toprevent distortions and/or degraded quality in the captured images. Foranother example, users may desire to mount the cameras in locationswhere the cameras are exposed to rain and direct sunlight. For yetanother example, users may desire a wide range of freedom to adjust theorientation (e.g., pitch and yaw) of the cameras after they are mounted.For yet another example, users may desire to mount the cameras inunsecure locations where the cameras are at risk of being appropriatedby scofflaws.

SUMMARY

Accordingly, there is a need for systems and/or devices with moreefficient, accurate, and effective methods for maintaining particulartemperatures within a camera assembly; capturing, analyzing, andtransmitting scenes by the camera assembly; compensating for exposure ofthe camera assembly to rain and/or direct sunlight; enabling a widerange of positional freedom for the camera assembly; and securing thecamera assembly to structure; among other things. Such systems, devices,and methods optionally complement or replace conventional systems,devices, and methods.

The present disclosure describes compact all-weather cameraimplementations with high-powered on-camera processing, low-light (e.g.,night-time) illumination, microphones and speakers for capturing andrelaying audio information, passive cooling, active heating,waterproofing, impact resistance, pressure equalization, an ability toconcurrently transmit multiple HD video streams, and an ability towirelessly communicate with other devices over multiple protocols (e.g.,Wi-Fi, Bluetooth, and IEEE 15.4). Such devices generate large amounts ofheat (e.g., from the processors) and yet include heat-sensitivecomponents, such as the image sensor. In such devices, it is importantto maintain the temperature of the high-sensitive components (e.g., viaactive heating and passive cooling) while maintaining the compact,passively-cooled aspects of the camera(s). In addition, the camera imagesensors are inherently sensitive to light, and thus it is important tokeep light from the camera's illuminators, color or IR, from enteringthe image sensor. Components for manipulating the light from thecamera's illuminators, e.g., lenses and diffusers, are important toprevent wash out or anomalies in the captured images. Theimplementations described herein include components configured toprevent heat and/or light from interfering with sensitive cameracomponents.

It is desirable to have a means of maintaining the temperature of theimage sensor(s) in a video camera. Image sensors are impacted by changesin ambient and/or operating temperatures. In many cases, the larger thetemperature changes the bigger the impact. In particular, changes intemperature can affect the focus or sharpness of the captured images.Thus, maintaining the temperature of the image sensor(s) is ofparticular importance for fixed-focus cameras that do not have a meansof refocusing to compensate for the temperature effects. Also, outdoorcameras may experience a wider range of temperatures (e.g., from minus40 Celsius to 55 Celsius). Thus, maintaining the temperature of theimage sensor(s) is also of particular importance for outdoor cameras. Insome implementations disclosed herein, the camera(s) include an activeheating component configured to maintain the image sensor(s) atdesirable operating temperatures during operation of the camera(s) byselectively supplying heat to the image sensor(s). In someimplementations disclosed herein, the camera(s) include passive coolingcomponent(s) configured to maintain the image sensor(s) at desirableoperating temperatures during operation of the camera(s) by dissipatingheat away from the image sensor(s).

It is also desirable to have lenses (e.g., toroidal lenses) for the IRilluminators to direct the illumination to uniformly illuminate theportion of the scene in the camera's field of view as this reducesanomalies and improves the quality of images captured by the imagesensor. It is also desirable to have the lenses adapted to minimize theamount of illumination sent outside of the camera's field of view. Byreducing the amount of illumination sent outside of the camera's fieldof view, the amount and/or intensity of the IR illuminators required toprovide adequate illumination is reduced. Although, for convenience, theilluminators and lenses are described herein as adapted for infraredlight, in some implementations other types of non-visible illuminatorsand lenses are used (e.g., ultraviolet illuminators and correspondinglenses).

It is also desirable to have a concave front face (also sometimes calleda cover glass or cover lens) as it inhibits water accumulation on frontface, provides shading (e.g., inhibits direct sunlight) for the imagesensor, and increases a quality of the images captured by the imagesensor.

It is also desirable that the camera provide visual and/or audiofeedback to a user (e.g., via a user interface in a smart homeapplication, or via audio and/or visual feedback from the camera). Thefeedback may concern an operational status of the camera itself, theoperational status of another electronic device associated with thecamera, and/or the operational status of a set of electronic devicesassociated with the camera.

In environments in which security cameras are commonly deployed, such asin a work or home environment (indoors or outdoors), it is advantageousto configure the camera with physical features that can provide realtime camera status information and/or audio/visual content thatindicates or complements camera processing activity, to occupants of theenvironment without disturbing operation of the camera or the occupants.In some implementations, such physical features include a light ringthat is provided at a periphery of the camera and is configured to bevisible to occupants of the environment from a wide range of positionsin the environment. For example, in some camera implementations, thelight ring is configured to be visible in a range of positions thatincludes at least areas of the environment that fall within the camera'sfield of view. In some camera implementations, the light ring has aplurality of individual lighting elements, each having associatedlighting characteristics that are individually controllable to reflectlocal camera status and/or a camera processing state/operation. In someconfigurations, the controllable lighting characteristics include one ormore of on/off state, hue, saturation and/or brightness/intensity. Insome configurations, the lighting elements are controlled individuallyto display an overall pattern (e.g., an entire ring or one or moreportions of a ring) that can be static or dynamic (e.g., one or morerotating portions of a ring) consisting of a single displayed color ortwo or more different displayed colors. Each of the patterns can conformto a visual language and correspond to a camera status and/or a cameraprocessing operation. For example, a color or a pattern of two or moredifferent colors (static or dynamic) can indicate that the camera is onor off, has an active or inactive connection to a server (e.g., a serverthat performs image processing or that distributes video andnotifications to remote users), is actively processing local informationfrom the environment, or has received a notification or statusinformation from another smart device in the home environment or aserver. In camera implementations that include a speaker, the physicalfeature (e.g., a light ring) can be controlled by the camera to displaypatterns that correspond to audible beats/rhythm of music being playedfrom the speaker in a range of colors selected to match thetempo/feeling of the music. Providing such information via lightpatterns is advantageous as this is readily perceived by all/most usersin the environment (even if they do not have access to camera smartphone app.) without intruding on activity of occupants in theenvironment, as audible alerts could do.

It is also desirable that the camera have a mount that both encloses thevarious interconnect wires and has a wide degree of rotational freedom.Enclosing the interconnect wires reduces wear on the wires, reduces theodds of the wires being damaged, increases the aesthetics for thecamera, and increases the rotational freedom of the camera. Increasingthe rotational freedom of the camera increases user satisfaction withthe camera as it increases the potential locations where the camera canbe placed to have a desired field of view. It is also desirable for thecamera mount to provide stable support for the camera, which, due to itssubstantial on-board processing power and communications capabilities,can be relatively heavy in comparison to its size, while also beingcompact and portable, so as to allow for a high degree of flexibility inplacement of the camera, and to provide for stable use of the camera, orfor attachment of the camera to a wide range of mounting surfaces in awide range of orientations.

It is also desirable that the camera operate continuously, or nearcontinuously, and thus heat generation and dissipation is veryimportant. Accordingly, there is a need for a substantially compactelectronic device to incorporate some heat dissipation mechanisms thatdissipate heat generated within the electronic device away from aheat-sensitive assembly of the electronic device. Specifically, inaccordance with some implementations, the heat dissipation mechanismspassively conduct heat generated by a heat-sensitive electronic assemblyand/or another heat generating electronic assembly away from theheat-sensitive electronic assembly efficiently without using a fan.Given a compact form factor of the electronic device, the heatdissipation mechanisms are also configured to mechanically support theheat-sensitive electronic assembly, the heat generating electronicassembly or both without interfering with intended functions of theelectronic device.

For example, the electronic device may include an Internet camera thatcontains a plurality of electronic assemblies in a compact housing andhas various capabilities for capturing, processing and streaming videoimages in real time. The electronic assemblies of the Internet camerainclude an image sensor assembly that is configured to capture and/orprocess the video image. The image sensor assembly is sensitive to heatgenerated by itself or by another system-on-chip (SoC) assembly. Todeter a detrimental impact from the heat, two separate sets of thermallyconductive parts could be used to conduct heat generated by the heatgenerating electronic assembly (e.g., the image sensor assembly of thecamera) and/or the heat-sensitive electronic assembly (e.g., the SoCassembly of the camera) away from the heat-sensitive electronicassembly, respectively. The two separate sets of thermally conductiveparts are closely disposed within the compact housing while beingthermally isolated from each other.

In one aspect, some implementations include camera assembly fordeployment in a smart home environment. The camera assembly includes:(1) a housing; (2) an image sensor encased in the housing and configuredto capture activity of the smart home environment; (3) a wireless radioconfigured to transmit video frames captured by the image sensor to anelectronic device via a remote server; (4) at least one infraredtransmitter configured to selectively illuminate the smart homeenvironment; (5) one or more circuit boards encased in the housing, theone or more circuit boards including at least one processor mountedthereon; and (6) a heating component coupled to the image sensor, theheating component configured to continuously maintain the image sensorat a temperature above a threshold temperature while the image sensor iscapturing the activity of the smart home environment.

In another aspect, some implementations include a camera assemblyadapted for use in a smart home environment. The camera assemblyincludes: (1) a housing; (2) an image sensor positioned within thehousing and having a field of view corresponding to a scene in the smarthome environment; and (3) a concave-shaped front face positioned infront of the image sensor such that light from the scene passes throughthe front face prior to entering the image sensor. In someimplementations, the front face includes: an inner section correspondingto the image sensor; and an outer section between the housing and theinner section, the outer section having a concave shape that extendsfrom the outer periphery of the outer section to the inner periphery ofthe outer section. In some implementations, the concave shape extendsaround the entirety of the periphery. In some implementations, thehousing and the front face are uniform in shape and symmetrical around acentral axis.

In another aspect, some implementations include an electronic devicehaving: (1) a base including a stem having a ball; (2) a hinge assemblycoupled to an electronics module and having a socket including aninterior surface that conforms to a first outer surface of the ballassembly to allow rotation and/or tipping of the socket about the ball;and (3) a biasing member coupled to the camera module and configured toimpose a force on a second outer surface of the ball assembly, thesecond outer surface being on a side of the ball opposite the firstouter surface and the force being sufficient to hold the electronicsmodule in a set position relative to the base.

In another aspect, some implementations include an attachment mechanismfor an electronic device having: (1) a mounting plate having at leastone projection; and (2) a base assembly having a mounting surfaceconfigured to engage the mounting plate and including an arm assemblyforming a central opening with a first position in which the armassembly projects partially into the recess and a second position inwhich the central opening is larger than in the first position, the armassembly configured to engage with and capture the at least oneprojection during a mounting operation in which the attachment mechanismis detachably mounted to the mounting plate, the arm assembly beingconcealed by the base assembly and the mounting plate when the baseassembly is attached to the mounting plate, the base assembly includingan actuation mechanism coupled to the arm assembly such that operationof the actuation mechanism causes movement of the arm assembly from thefirst position to the second position, enabling detachment of the baseassembly from the mounting plate.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the various described implementations,reference should be made to the Description of Implementations below, inconjunction with the following drawings in which like reference numeralsrefer to corresponding parts throughout the figures.

FIG. 1 is an example smart home environment in accordance with someimplementations.

FIG. 2A is a block diagram illustrating a representative networkarchitecture that includes a smart home network in accordance with someimplementations.

FIG. 2B is a representative operating environment in which a serversystem interacts with client devices and smart devices in accordancewith some implementations.

FIG. 3A is a block diagram illustrating a representative server system,in accordance with some implementations.

FIG. 3B illustrates various data structures used by someimplementations.

FIG. 4 is a block diagram illustrating a representative smart device, inaccordance with some implementations.

FIG. 5 illustrates a representative system architecture for videoanalysis and categorization, in accordance with some implementations.

FIG. 6 is a block diagram illustrating a representative client device,in accordance with some implementations.

FIGS. 7A-7B are perspective views of a representative camera assembly inaccordance with some implementations.

FIGS. 8A-8D are component views of a representative camera assembly inaccordance with some implementations.

FIGS. 9A-9D are component views illustrating a representative cameraassembly in accordance with some implementations.

FIGS. 10A-10B are additional component views illustrating arepresentative camera assembly in accordance with some implementations.

FIGS. 11A-11C are additional component views illustrating arepresentative camera assembly in accordance with some implementations.

FIGS. 12A-12B are component views illustrating a representative speakerassembly in accordance with some implementations.

FIGS. 13A-13C are component views illustrating a representative circuitboard assembly in accordance with some implementations.

Like reference numerals refer to corresponding parts throughout theseveral views of the drawings.

DESCRIPTION OF IMPLEMENTATIONS

FIG. 1 is an example smart home environment 100 in accordance with someimplementations. The smart home environment 100 includes a structure 150(e.g., a house, office building, garage, or mobile home) with variousintegrated devices. It will be appreciated that devices may also beintegrated into a smart home environment 100 that does not include anentire structure 150, such as an apartment, condominium, or officespace. Further, the smart home environment 100 may control and/or becoupled to devices outside of the actual structure 150. Indeed, severaldevices in the smart home environment 100 need not be physically withinthe structure 150. For example, a device controlling a pool heater 114or irrigation system 116 may be located outside of the structure 150.

It is to be appreciated that “smart home environments” may refer tosmart environments for homes such as a single-family house, but thescope of the present teachings is not so limited. The present teachingsare also applicable, without limitation, to duplexes, townhomes,multi-unit apartment buildings, hotels, retail stores, office buildings,industrial buildings, and more generally any living space or work space.

It is also to be appreciated that while the terms user, customer,installer, homeowner, occupant, guest, tenant, landlord, repair person,and the like may be used to refer to the person or persons acting in thecontext of some particularly situations described herein, thesereferences do not limit the scope of the present teachings with respectto the person or persons who are performing such actions. Thus, forexample, the terms user, customer, purchaser, installer, subscriber, andhomeowner may often refer to the same person in the case of asingle-family residential dwelling, because the head of the household isoften the person who makes the purchasing decision, buys the unit, andinstalls and configures the unit, and is also one of the users of theunit. However, in other scenarios, such as a landlord-tenantenvironment, the customer may be the landlord with respect to purchasingthe unit, the installer may be a local apartment supervisor, a firstuser may be the tenant, and a second user may again be the landlord withrespect to remote control functionality. Importantly, while the identityof the person performing the action may be germane to a particularadvantage provided by one or more of the implementations, such identityshould not be construed in the descriptions that follow as necessarilylimiting the scope of the present teachings to those particularindividuals having those particular identities.

The depicted structure 150 includes a plurality of rooms 152, separatedat least partly from each other via walls 154. The walls 154 may includeinterior walls or exterior walls. Each room may further include a floor156 and a ceiling 158. Devices may be mounted on, integrated with and/orsupported by a wall 154, floor 156 or ceiling 158.

In some implementations, the integrated devices of the smart homeenvironment 100 include intelligent, multi-sensing, network-connecteddevices that integrate seamlessly with each other in a smart homenetwork (e.g., 202 FIG. 2A) and/or with a central server or acloud-computing system to provide a variety of useful smart homefunctions. The smart home environment 100 may include one or moreintelligent, multi-sensing, network-connected thermostats 102(hereinafter referred to as “smart thermostats 102”), one or moreintelligent, network-connected, multi-sensing hazard detection units 104(hereinafter referred to as “smart hazard detectors 104”), one or moreintelligent, multi-sensing, network-connected entryway interface devices106 and 120 (hereinafter referred to as “smart doorbells 106” and “smartdoor locks 120”), and one or more intelligent, multi-sensing,network-connected alarm systems 122 (hereinafter referred to as “smartalarm systems 122”).

In some implementations, the one or more smart thermostats 102 detectambient climate characteristics (e.g., temperature and/or humidity) andcontrol a HVAC system 103 accordingly. For example, a respective smartthermostat 102 includes an ambient temperature sensor.

The one or more smart hazard detectors 104 may include thermal radiationsensors directed at respective heat sources (e.g., a stove, oven, otherappliances, a fireplace, etc.). For example, a smart hazard detector 104in a kitchen 153 includes a thermal radiation sensor directed at astove/oven 112. A thermal radiation sensor may determine the temperatureof the respective heat source (or a portion thereof) at which it isdirected and may provide corresponding blackbody radiation data asoutput.

The smart doorbell 106 and/or the smart door lock 120 may detect aperson's approach to or departure from a location (e.g., an outer door),control doorbell/door locking functionality (e.g., receive user inputsfrom a portable electronic device 166-1 to actuate bolt of the smartdoor lock 120), announce a person's approach or departure via audio orvisual means, and/or control settings on a security system (e.g., toactivate or deactivate the security system when occupants go and come).In some implementations, the smart doorbell 106 includes some or all ofthe components and features of the camera 118. In some implementations,the smart doorbell 106 includes a camera 118.

The smart alarm system 122 may detect the presence of an individualwithin close proximity (e.g., using built-in IR sensors), sound an alarm(e.g., through a built-in speaker, or by sending commands to one or moreexternal speakers), and send notifications to entities or userswithin/outside of the smart home network 100. In some implementations,the smart alarm system 122 also includes one or more input devices orsensors (e.g., keypad, biometric scanner, NFC transceiver, microphone)for verifying the identity of a user, and one or more output devices(e.g., display, speaker). In some implementations, the smart alarmsystem 122 may also be set to an “armed” mode, such that detection of atrigger condition or event causes the alarm to be sounded unless adisarming action is performed.

In some implementations, the smart home environment 100 includes one ormore intelligent, multi-sensing, network-connected wall switches 108(hereinafter referred to as “smart wall switches 108”), along with oneor more intelligent, multi-sensing, network-connected wall pluginterfaces 110 (hereinafter referred to as “smart wall plugs 110”). Thesmart wall switches 108 may detect ambient lighting conditions, detectroom-occupancy states, and control a power and/or dim state of one ormore lights. In some instances, smart wall switches 108 may also controla power state or speed of a fan, such as a ceiling fan. The smart wallplugs 110 may detect occupancy of a room or enclosure and control supplyof power to one or more wall plugs (e.g., such that power is notsupplied to the plug if nobody is at home).

In some implementations, the smart home environment 100 of FIG. 1includes a plurality of intelligent, multi-sensing, network-connectedappliances 112 (hereinafter referred to as “smart appliances 112”), suchas refrigerators, stoves, ovens, televisions, washers, dryers, lights,stereos, intercom systems, garage-door openers, floor fans, ceilingfans, wall air conditioners, pool heaters, irrigation systems, securitysystems, space heaters, window AC units, motorized duct vents, and soforth. In some implementations, when plugged in, an appliance mayannounce itself to the smart home network, such as by indicating whattype of appliance it is, and it may automatically integrate with thecontrols of the smart home. Such communication by the appliance to thesmart home may be facilitated by either a wired or wirelesscommunication protocol. The smart home may also include a variety ofnon-communicating legacy appliances 140, such as old conventionalwasher/dryers, refrigerators, and the like, which may be controlled bysmart wall plugs 110. The smart home environment 100 may further includea variety of partially communicating legacy appliances 142, such asinfrared (“IR”) controlled wall air conditioners or other IR-controlleddevices, which may be controlled by IR signals provided by the smarthazard detectors 104 or the smart wall switches 108.

In some implementations, the smart home environment 100 includes one ormore network-connected camera assemblies 118 (sometimes called cameras118) that are configured to provide video monitoring and security in thesmart home environment 100. The cameras 118 may be used to determineoccupancy of the structure 150 and/or particular rooms 152 in thestructure 150, and thus may act as occupancy sensors. For example, videocaptured by the cameras 118 may be processed to identify the presence ofan occupant in the structure 150 (e.g., in a particular room 152).Specific individuals may be identified based, for example, on theirappearance (e.g., height, face) and/or movement (e.g., their walk/gait).Cameras 118 may additionally include one or more sensors (e.g., IRsensors, motion detectors), input devices (e.g., microphone forcapturing audio), and output devices (e.g., speaker for outputtingaudio). In some implementations, the cameras 118 are each configured tooperate in a day mode and in a low-light mode (e.g., a night mode). Insome implementations, the cameras 118 each include one or more IRilluminators for providing illumination while the camera is operating inthe low-light mode. In some implementations, the cameras 118 include oneor more outdoor cameras. In some implementations, the outdoor camerasinclude additional features and/or components such as weatherproofingand/or solar ray compensation.

The smart home environment 100 may additionally or alternatively includeone or more other occupancy sensors (e.g., the smart doorbell 106, smartdoor locks 120, touch screens, IR sensors, microphones, ambient lightsensors, motion detectors, smart nightlights 170, etc.). In someimplementations, the smart home environment 100 includes radio-frequencyidentification (RFID) readers (e.g., in each room 152 or a portionthereof) that determine occupancy based on RFID tags located on orembedded in occupants. For example, RFID readers may be integrated intothe smart hazard detectors 104.

The smart home environment 100 may also include communication withdevices outside of the physical home but within a proximate geographicalrange of the home. For example, the smart home environment 100 mayinclude a pool heater monitor 114 that communicates a current pooltemperature to other devices within the smart home environment 100and/or receives commands for controlling the pool temperature.Similarly, the smart home environment 100 may include an irrigationmonitor 116 that communicates information regarding irrigation systemswithin the smart home environment 100 and/or receives controlinformation for controlling such irrigation systems.

By virtue of network connectivity, one or more of the smart home devicesof FIG. 1 may further allow a user to interact with the device even ifthe user is not proximate to the device. For example, a user maycommunicate with a device using a computer (e.g., a desktop computer,laptop computer, or tablet) or other portable electronic device 166(e.g., a mobile phone, such as a smart phone). A webpage or applicationmay be configured to receive communications from the user and controlthe device based on the communications and/or to present informationabout the device's operation to the user. For example, the user may viewa current set point temperature for a device (e.g., a stove) and adjustit using a computer. The user may be in the structure during this remotecommunication or outside the structure.

As discussed above, users may control smart devices in the smart homeenvironment 100 using a network-connected computer or portableelectronic device 166. In some examples, some or all of the occupants(e.g., individuals who live in the home) may register their device 166with the smart home environment 100. Such registration may be made at acentral server to authenticate the occupant and/or the device as beingassociated with the home and to give permission to the occupant to usethe device to control the smart devices in the home. An occupant may usetheir registered device 166 to remotely control the smart devices of thehome, such as when the occupant is at work or on vacation. The occupantmay also use their registered device to control the smart devices whenthe occupant is actually located inside the home, such as when theoccupant is sitting on a couch inside the home. It should be appreciatedthat instead of or in addition to registering devices 166, the smarthome environment 100 may make inferences about which individuals live inthe home and are therefore occupants and which devices 166 areassociated with those individuals. As such, the smart home environmentmay “learn” who is an occupant and permit the devices 166 associatedwith those individuals to control the smart devices of the home.

In some implementations, in addition to containing processing andsensing capabilities, devices 102, 104, 106, 108, 110, 112, 114, 116,118, 120, and/or 122 (collectively referred to as “the smart devices”)are capable of data communications and information sharing with othersmart devices, a central server or cloud-computing system, and/or otherdevices that are network-connected. Data communications may be carriedout using any of a variety of custom or standard wireless protocols(e.g., IEEE 802.15.4, Wi-Fi, ZigBee, 6LoWPAN, Thread, Z-Wave, BluetoothSmart, ISA100.5A, WirelessHART, MiWi, etc.) and/or any of a variety ofcustom or standard wired protocols (e.g., Ethernet, HomePlug, etc.), orany other suitable communication protocol, including communicationprotocols not yet developed as of the filing date of this document.

In some implementations, the smart devices serve as wireless or wiredrepeaters. In some implementations, a first one of the smart devicescommunicates with a second one of the smart devices via a wirelessrouter. The smart devices may further communicate with each other via aconnection (e.g., network interface 160) to a network, such as theInternet 162. Through the Internet 162, the smart devices maycommunicate with a server system 164 (also called a central serversystem and/or a cloud-computing system herein). The server system 164may be associated with a manufacturer, support entity, or serviceprovider associated with the smart device(s). In some implementations, auser is able to contact customer support using a smart device itselfrather than needing to use other communication means, such as atelephone or Internet-connected computer. In some implementations,software updates are automatically sent from the server system 164 tosmart devices (e.g., when available, when purchased, or at routineintervals).

In some implementations, the network interface 160 includes aconventional network device (e.g., a router), and the smart homeenvironment 100 of FIG. 1 includes a hub device 180 that iscommunicatively coupled to the network(s) 162 directly or via thenetwork interface 160. The hub device 180 is further communicativelycoupled to one or more of the above intelligent, multi-sensing,network-connected devices (e.g., smart devices of the smart homeenvironment 100). Each of these smart devices optionally communicateswith the hub device 180 using one or more radio communication networksavailable at least in the smart home environment 100 (e.g., ZigBee,Z-Wave, Insteon, Bluetooth, Wi-Fi and other radio communicationnetworks). In some implementations, the hub device 180 and devicescoupled with/to the hub device can be controlled and/or interacted withvia an application running on a smart phone, household controller,laptop, tablet computer, game console or similar electronic device. Insome implementations, a user of such controller application can viewstatus of the hub device or coupled smart devices, configure the hubdevice to interoperate with smart devices newly introduced to the homenetwork, commission new smart devices, and adjust or view settings ofconnected smart devices, etc. In some implementations the hub deviceextends capabilities of low capability smart device to matchcapabilities of the highly capable smart devices of the same type,integrates functionality of multiple different device types—even acrossdifferent communication protocols, and is configured to streamlineadding of new devices and commissioning of the hub device. In someimplementations, hub device 180 further comprises a local storage devicefor storing data related to, or output by, smart devices of smart homeenvironment 100. In some implementations, the data includes one or moreof: video data output by a camera device, metadata output by a smartdevice, settings information for a smart device, usage logs for a smartdevice, and the like.

In some implementations, smart home environment 100 includes a localstorage device 190 for storing data related to, or output by, smartdevices of smart home environment 100. In some implementations, the dataincludes one or more of: video data output by a camera device (e.g.,camera 118), metadata output by a smart device, settings information fora smart device, usage logs for a smart device, and the like. In someimplementations, local storage device 190 is communicatively coupled toone or more smart devices via a smart home network (e.g., smart homenetwork 202, FIG. 2A). In some implementations, local storage device 190is selectively coupled to one or more smart devices via a wired and/orwireless communication network. In some implementations, local storagedevice 190 is used to store video data when external network conditionsare poor. For example, local storage device 190 is used when an encodingbitrate of camera 118 exceeds the available bandwidth of the externalnetwork (e.g., network(s) 162). In some implementations, local storagedevice 190 temporarily stores video data from one or more cameras (e.g.,camera 118) prior to transferring the video data to a server system(e.g., server system 164).

FIG. 2A is a block diagram illustrating a representative networkarchitecture 200 that includes a smart home network 202 in accordancewith some implementations. In some implementations, the smart devices204 in the smart home environment 100 (e.g., devices 102, 104, 106, 108,110, 112, 114, 116, 118, 120, and/or 122) combine with the hub device180 to create a mesh network in smart home network 202. In someimplementations, one or more smart devices 204 in the smart home network202 operate as a smart home controller. Additionally and/oralternatively, hub device 180 operates as the smart home controller. Insome implementations, a smart home controller has more computing powerthan other smart devices. In some implementations, a smart homecontroller processes inputs (e.g., from smart devices 204, electronicdevice 166, and/or server system 164) and sends commands (e.g., to smartdevices 204 in the smart home network 202) to control operation of thesmart home environment 100. In some implementations, some of the smartdevices 204 in the smart home network 202 (e.g., in the mesh network)are “spokesman” nodes (e.g., 204-1) and others are “low-powered” nodes(e.g., 204-9). Some of the smart devices in the smart home environment100 are battery powered, while others have a regular and reliable powersource, such as by connecting to wiring (e.g., to 120V line voltagewires) behind the walls 154 of the smart home environment. The smartdevices that have a regular and reliable power source are referred to as“spokesman” nodes. These nodes are typically equipped with thecapability of using a wireless protocol to facilitate bidirectionalcommunication with a variety of other devices in the smart homeenvironment 100, as well as with the server system 164. In someimplementations, one or more “spokesman” nodes operate as a smart homecontroller. On the other hand, the devices that are battery powered arethe “low-power” nodes. These nodes tend to be smaller than spokesmannodes and typically only communicate using wireless protocols thatrequire very little power, such as Zigbee, ZWave, 6LoWPAN, Thread,Bluetooth, etc.

In some implementations, some low-power nodes are incapable ofbidirectional communication. These low-power nodes send messages, butthey are unable to “listen”. Thus, other devices in the smart homeenvironment 100, such as the spokesman nodes, cannot send information tothese low-power nodes.

In some implementations, some low-power nodes are capable of only alimited bidirectional communication. For example, other devices are ableto communicate with the low-power nodes only during a certain timeperiod.

As described, in some implementations, the smart devices serve aslow-power and spokesman nodes to create a mesh network in the smart homeenvironment 100. In some implementations, individual low-power nodes inthe smart home environment regularly send out messages regarding whatthey are sensing, and the other low-powered nodes in the smart homeenvironment—in addition to sending out their own messages—forward themessages, thereby causing the messages to travel from node to node(i.e., device to device) throughout the smart home network 202. In someimplementations, the spokesman nodes in the smart home network 202,which are able to communicate using a relatively high-powercommunication protocol, such as IEEE 802.11, are able to switch to arelatively low-power communication protocol, such as IEEE 802.15.4, toreceive these messages, translate the messages to other communicationprotocols, and send the translated messages to other spokesman nodesand/or the server system 164 (using, e.g., the relatively high-powercommunication protocol). Thus, the low-powered nodes using low-powercommunication protocols are able to send and/or receive messages acrossthe entire smart home network 202, as well as over the Internet 162 tothe server system 164. In some implementations, the mesh network enablesthe server system 164 to regularly receive data from most or all of thesmart devices in the home, make inferences based on the data, facilitatestate synchronization across devices within and outside of the smarthome network 202, and send commands to one or more of the smart devicesto perform tasks in the smart home environment.

As described, the spokesman nodes and some of the low-powered nodes arecapable of “listening.” Accordingly, users, other devices, and/or theserver system 164 may communicate control commands to the low-powerednodes. For example, a user may use the electronic device 166 (e.g., asmart phone) to send commands over the Internet to the server system164, which then relays the commands to one or more spokesman nodes inthe smart home network 202. The spokesman nodes may use a low-powerprotocol to communicate the commands to the low-power nodes throughoutthe smart home network 202, as well as to other spokesman nodes that didnot receive the commands directly from the server system 164.

In some implementations, a smart nightlight 170 (FIG. 1), which is anexample of a smart device 204, is a low-power node. In addition tohousing a light source, the smart nightlight 170 houses an occupancysensor, such as an ultrasonic or passive IR sensor, and an ambient lightsensor, such as a photo resistor or a single-pixel sensor that measureslight in the room. In some implementations, the smart nightlight 170 isconfigured to activate the light source when its ambient light sensordetects that the room is dark and when its occupancy sensor detects thatsomeone is in the room. In other implementations, the smart nightlight170 is simply configured to activate the light source when its ambientlight sensor detects that the room is dark. Further, in someimplementations, the smart nightlight 170 includes a low-power wirelesscommunication chip (e.g., a ZigBee chip) that regularly sends outmessages regarding the occupancy of the room and the amount of light inthe room, including instantaneous messages coincident with the occupancysensor detecting the presence of a person in the room. As mentionedabove, these messages may be sent wirelessly (e.g., using the meshnetwork) from node to node (i.e., smart device to smart device) withinthe smart home network 202 as well as over the Internet 162 to theserver system 164.

Other examples of low-power nodes include battery-operated versions ofthe smart hazard detectors 104. These smart hazard detectors 104 areoften located in an area without access to constant and reliable powerand may include any number and type of sensors, such as smoke/fire/heatsensors (e.g., thermal radiation sensors), carbon monoxide/dioxidesensors, occupancy/motion sensors, ambient light sensors, ambienttemperature sensors, humidity sensors, and the like. Furthermore, smarthazard detectors 104 may send messages that correspond to each of therespective sensors to the other devices and/or the server system 164,such as by using the mesh network as described above.

Examples of spokesman nodes include smart doorbells 106, smartthermostats 102, smart wall switches 108, and smart wall plugs 110.These devices are often located near and connected to a reliable powersource, and therefore may include more power-consuming components, suchas one or more communication chips capable of bidirectionalcommunication in a variety of protocols.

In some implementations, the smart home environment 100 includes servicerobots 168 (FIG. 1) that are configured to carry out, in an autonomousmanner, any of a variety of household tasks.

As explained above with reference to FIG. 1, in some implementations,the smart home environment 100 of FIG. 1 includes a hub device 180 thatis communicatively coupled to the network(s) 162 directly or via thenetwork interface 160. The hub device 180 is further communicativelycoupled to one or more of the smart devices using a radio communicationnetwork that is available at least in the smart home environment 100.Communication protocols used by the radio communication network include,but are not limited to, ZigBee, Z-Wave, Insteon, EuOcean, Thread, OSIAN,Bluetooth Low Energy and the like. In some implementations, the hubdevice 180 not only converts the data received from each smart device tomeet the data format requirements of the network interface 160 or thenetwork(s) 162, but also converts information received from the networkinterface 160 or the network(s) 162 to meet the data format requirementsof the respective communication protocol associated with a targetedsmart device. In some implementations, in addition to data formatconversion, the hub device 180 further processes the data received fromthe smart devices or information received from the network interface 160or the network(s) 162 preliminary. For example, the hub device 180 canintegrate inputs from multiple sensors/connected devices (includingsensors/devices of the same and/or different types), perform higherlevel processing on those inputs—e.g., to assess the overall environmentand coordinate operation among the different sensors/devices—and/orprovide instructions to the different devices based on the collection ofinputs and programmed processing. It is also noted that in someimplementations, the network interface 160 and the hub device 180 areintegrated to one network device. Functionality described herein isrepresentative of particular implementations of smart devices, controlapplication(s) running on representative electronic device(s) (such as asmart phone), hub device(s) 180, and server(s) coupled to hub device(s)via the Internet or other Wide Area Network. All or a portion of thisfunctionality and associated operations can be performed by any elementsof the described system—for example, all or a portion of thefunctionality described herein as being performed by an implementationof the hub device can be performed, in different system implementations,in whole or in part on the server, one or more connected smart devicesand/or the control application, or different combinations thereof.

FIG. 2B illustrates a representative operating environment in which aserver system 164 provides data processing for monitoring andfacilitating review of events (e.g., motion, audio, security, etc.) invideo streams captured by video cameras 118. As shown in FIG. 2B, theserver system 164 receives video data from video sources 222 (includingcameras 118) located at various physical locations (e.g., inside homes,restaurants, stores, streets, parking lots, and/or the smart homeenvironments 100 of FIG. 1). Each video source 222 may be bound to oneor more reviewer accounts, and the server system 164 provides videomonitoring data for the video source 222 to client devices 220associated with the reviewer accounts. For example, the portableelectronic device 166 is an example of the client device 220. In someimplementations, the server system 164 is a video processing server thatprovides video processing services to video sources and client devices220.

In some implementations, each of the video sources 222 includes one ormore video cameras 118 that capture video and send the captured video tothe server system 164 substantially in real-time. In someimplementations, each of the video sources 222 includes a controllerdevice (not shown) that serves as an intermediary between the one ormore cameras 118 and the server system 164. The controller devicereceives the video data from the one or more cameras 118, optionallyperforms some preliminary processing on the video data, and sends thevideo data to the server system 164 on behalf of the one or more cameras118 substantially in real-time. In some implementations, each camera hasits own on-board processing capabilities to perform some preliminaryprocessing on the captured video data before sending the processed videodata (along with metadata obtained through the preliminary processing)to the controller device and/or the server system 164.

In accordance with some implementations, each of the client devices 220includes a client-side module. The client-side module communicates witha server-side module executed on the server system 164 through the oneor more networks 162. The client-side module provides client-sidefunctionality for the event monitoring and review processing andcommunications with the server-side module. The server-side moduleprovides server-side functionality for event monitoring and reviewprocessing for any number of client-side modules each residing on arespective client device 220. The server-side module also providesserver-side functionality for video processing and camera control forany number of the video sources 222, including any number of controldevices and the cameras 118.

In some implementations, the server system 164 includes one or moreprocessors 212, a video storage database 210, an account database 214,an I/O interface to one or more client devices 216, and an I/O interfaceto one or more video sources 218. The I/O interface to one or moreclients 216 facilitates the client-facing input and output processing.The account database 214 stores a plurality of profiles for revieweraccounts registered with the video processing server, where a respectiveuser profile includes account credentials for a respective revieweraccount, and one or more video sources linked to the respective revieweraccount. The I/O interface to one or more video sources 218 facilitatescommunications with one or more video sources 222 (e.g., groups of oneor more cameras 118 and associated controller devices). The videostorage database 210 stores raw video data received from the videosources 222, as well as various types of metadata, such as motionevents, event categories, event category models, event filters, andevent masks, for use in data processing for event monitoring and reviewfor each reviewer account.

Examples of a representative client device 220 include a handheldcomputer, a wearable computing device, a personal digital assistant(PDA), a tablet computer, a laptop computer, a desktop computer, acellular telephone, a smart phone, an enhanced general packet radioservice (EGPRS) mobile phone, a media player, a navigation device, agame console, a television, a remote control, a point-of-sale (POS)terminal, a vehicle-mounted computer, an ebook reader, or a combinationof any two or more of these data processing devices or other dataprocessing devices.

Examples of the one or more networks 162 include local area networks(LAN) and wide area networks (WAN) such as the Internet. The one or morenetworks 162 are implemented using any known network protocol, includingvarious wired or wireless protocols, such as Ethernet, Universal SerialBus (USB), FIREWIRE, Long Term Evolution (LTE), Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), codedivision multiple access (CDMA), time division multiple access (TDMA),Bluetooth, Wi-Fi, voice over Internet Protocol (VoIP), Wi-MAX, or anyother suitable communication protocol.

In some implementations, the server system 164 is implemented on one ormore standalone data processing apparatuses or a distributed network ofcomputers. In some implementations, the server system 164 also employsvarious virtual devices and/or services of third party service providers(e.g., third-party cloud service providers) to provide the underlyingcomputing resources and/or infrastructure resources of the server system164. In some implementations, the server system 164 includes, but is notlimited to, a server computer, a handheld computer, a tablet computer, alaptop computer, a desktop computer, or a combination of any two or moreof these data processing devices or other data processing devices.

The server-client environment shown in FIG. 2B includes both aclient-side portion (e.g., the client-side module) and a server-sideportion (e.g., the server-side module). The division of functionalitybetween the client and server portions of operating environment can varyin different implementations. Similarly, the division of functionalitybetween a video source 222 and the server system 164 can vary indifferent implementations. For example, in some implementations, theclient-side module is a thin-client that provides only user-facing inputand output processing functions, and delegates all other data processingfunctionality to a backend server (e.g., the server system 164).Similarly, in some implementations, a respective one of the videosources 222 is a simple video capturing device that continuouslycaptures and streams video data to the server system 164 with limited orno local preliminary processing on the video data. Although many aspectsof the present technology are described from the perspective of theserver system 164, the corresponding actions performed by a clientdevice 220 and/or the video sources 222 would be apparent to one ofskill in the art. Similarly, some aspects of the present technology maybe described from the perspective of a client device or a video source,and the corresponding actions performed by the video server would beapparent to one of skill in the art. Furthermore, some aspects of thepresent technology may be performed by the server system 164, a clientdevice 220, and a video source 222 cooperatively.

In some implementations, a video source 222 (e.g., a camera 118)transmits one or more streams of video data to the server system 164. Insome implementations, the one or more streams may include multiplestreams, of respective resolutions and/or frame rates, of the raw videocaptured by the camera 118. In some implementations, the multiplestreams may include a “primary” stream with a certain resolution andframe rate, corresponding to the raw video captured by the camera 118,and one or more additional streams. An additional stream may be the samevideo stream as the “primary” stream but at a different resolutionand/or frame rate, or a stream that captures a portion of the “primary”stream (e.g., cropped to include a portion of the field of view orpixels of the primary stream) at the same or different resolution and/orframe rate as the “primary” stream.

In some implementations, one or more of the streams are sent from thevideo source 222 directly to a client device 220 (e.g., without beingrouted to, or processed by, the server system 164). In someimplementations, one or more of the streams is stored at the camera 118(e.g., in memory 406, FIG. 4) and/or a local storage device (e.g., adedicated recording device), such as a digital video recorder (DVR). Forexample, in accordance with some implementations, the camera 118 storesthe most recent 24 hours of video footage recorded by the camera. Insome implementations, portions of the one or more streams are stored atthe camera 118 and/or the local storage device (e.g., portionscorresponding to particular events or times of interest).

In some implementations, the server system 164 transmits one or morestreams of video data to a client device 220 to facilitate eventmonitoring by a user. In some implementations, the one or more streamsmay include multiple streams, of respective resolutions and/or framerates, of the same video feed. In some implementations, the multiplestreams include a “primary” stream with a certain resolution and framerate, corresponding to the video feed, and one or more additionalstreams. An additional stream may be the same video stream as the“primary” stream but at a different resolution and/or frame rate, or astream that shows a portion of the “primary” stream (e.g., cropped toinclude portion of the field of view or pixels of the primary stream) atthe same or different resolution and/or frame rate as the “primary”stream, as described in greater detail in U.S. patent application Ser.No. 15/594,518.

FIG. 3A is a block diagram illustrating the server system 164 inaccordance with some implementations. The server system 164 typicallyincludes one or more processing units (CPUs) 302, one or more networkinterfaces 304 (e.g., including an I/O interface to one or more clientdevices and an I/O interface to one or more electronic devices), memory306, and one or more communication buses 308 for interconnecting thesecomponents (sometimes called a chipset). The memory 306 includeshigh-speed random access memory, such as DRAM, SRAM, DDR SRAM, or otherrandom access solid state memory devices; and, optionally, includesnon-volatile memory, such as one or more magnetic disk storage devices,one or more optical disk storage devices, one or more flash memorydevices, or one or more other non-volatile solid state storage devices.The memory 306, optionally, includes one or more storage devicesremotely located from one or more processing units 302. The memory 306,or alternatively the non-volatile memory within memory 306, includes anon-transitory computer readable storage medium. In someimplementations, the memory 306, or the non-transitory computer readablestorage medium of the memory 306, stores the following programs,modules, and data structures, or a subset or superset thereof:

-   -   an operating system 310 including procedures for handling        various basic system services and for performing hardware        dependent tasks;    -   a network communication module 312 for connecting the server        system 164 to other systems and devices (e.g., client devices,        electronic devices, and systems connected to one or more        networks 162) via one or more network interfaces 304 (wired or        wireless);    -   a server-side module 314, which provides server-side        functionalities for device control, data processing, and data        review, including, but not limited to:        -   a data receiving module 3140 for receiving data from            electronic devices (e.g., video data from a camera 118,            FIG. 1) via the hub device 180, and preparing the received            data for further processing and storage in the data storage            database 3160;        -   a hub and device control module 3142 for generating and            sending server-initiated control commands to modify            operation modes of electronic devices (e.g., devices of a            smart home environment 100), and/or receiving (e.g., from            client devices 220) and forwarding user-initiated control            commands to modify operation modes of the electronic            devices;        -   a data processing module 3144 for processing the data            provided by the electronic devices, and/or preparing and            sending processed data to a device for review (e.g., client            devices 220 for review by a user), including, but not            limited to:            -   an event processor sub-module 3146 for processing event                candidates and/or events within a received video stream                (e.g., a video stream from cameras 118); and            -   a user interface sub-module 3150 for communicating with                a user (e.g., sending alerts, timeline events, etc. and                receiving user edits and zone definitions and the like)    -   a server database 316, including but not limited to:        -   a data storage database 3160 for storing data associated            with each electronic device (e.g., each camera) of each user            account, as well as data processing models, processed data            results, and other relevant metadata (e.g., names of data            results, location of electronic device, creation time,            duration, settings of the electronic device, etc.)            associated with the data, where (optionally) all or a            portion of the data and/or processing associated with the            hub device 180 or smart devices are stored securely;        -   an account database 3162 for storing account information for            user accounts, including user account information such as            user profiles 3163, information and settings for linked hub            devices and electronic devices (e.g., hub device            identifications), hub device specific secrets, relevant user            and hardware characteristics (e.g., service tier, device            model, storage capacity, processing capabilities, etc.),            user interface settings, data review preferences, etc.,            where the information for associated electronic devices            includes, but is not limited to, one or more device            identifiers (e.g., MAC address and UUID), device specific            secrets, and displayed titles;        -   a device information database 3164 for storing device            information related to one or more devices such as device            profiles 3165, e.g., device identifiers and hub device            specific secrets, independently of whether the corresponding            hub devices have been associated with any user account; and        -   an event information database 3166 for storing event            information such as event records 3168, e.g., event log            information, event categories, and the like.

Each of the above identified elements may be stored in one or more ofthe previously mentioned memory devices, and corresponds to a set ofinstructions for performing a function described above. The aboveidentified modules or programs (i.e., sets of instructions) need not beimplemented as separate software programs, procedures, or modules, andthus various subsets of these modules may be combined or otherwiserearranged in various implementations. In some implementations, thememory 306, optionally, stores a subset of the modules and datastructures identified above. Furthermore, the memory 306, optionally,stores additional modules and data structures not described above.

FIG. 3B illustrates various data structures used by someimplementations, including an event record 3168-i, a user profile3163-j, and a device profile 3165-j. The event record 3168-i correspondsto an event i and data for the event i. In some instances, the data formotion event i includes event start data 31681 indicating when and/orhow the event started, event segments data 31682, raw video data 31683,event end data 31684 indicating when and/or how the event ended, eventfeatures data 31685, scene features data 31686, associated userinformation 31687, and associated devices information 31688. In someinstances, the event record 3168-i includes only a subset of the abovedata. In some instances, the event record 3168-i includes additionalevent data not shown such as data regarding event/motion masks.

The event start data 31681 includes date and time information such as atimestamp and optionally includes additional information such asinformation regarding the amount of motion present, a motion startlocation, amount of audio present, characteristics of the audio, and thelike. Similarly, the event end data 31684 includes date and timeinformation such as a timestamp and optionally includes additionalinformation such as information regarding the amount of motion present,a motion start location, amount of audio present, characteristics of theaudio, and the like.

The event segments 31682 includes information regarding segmentation ofmotion event i. In some instances, event segments are stored separatelyfrom the raw video data 31683. In some instances, the event segments arestored at a lower display resolution than the raw video data. Forexample, the event segments are optionally stored at 480p or 780p andthe raw video data is stored at 1080i or 1080p. Storing the eventsegments at a lower display resolution enables the system to devote lesstime and resources to retrieving and processing the event segments. Insome instances, the event segments are not stored separately and thesegmentation information includes references to the raw video data 31683as well as date and time information for reproducing the event segments.In some implementations, the event segments include one or more audiosegments (e.g., corresponding to video segments).

The event features data 31685 includes information regarding eventfeatures such as event categorizations/classifications, object masks,motion masks, identified/recognized/tracked motion objects (alsosometimes called blobs), information regarding features of the motionobjects (e.g., object color, object dimensions, velocity, size changes,etc.), information regarding activity in zones of interest, and thelike. The scene features data 31686 includes information regarding thescene in which the event took place such as depth map information,information regarding the location of windows, televisions, fans, theceiling/floor, etc., information regarding whether the scene is indoorsor outdoors, information regarding zones of interest, and the like. Insome implementations, the event features data includes audio data, suchas volume, pitch, characterizations, and the like.

The associated user information 31687 includes information regardingusers associated with the event such as users identified in the event,users receiving notification of the event, and the like. In someinstances, the associated user information 31687 includes a link,pointer, or reference to a user profile 3163 for to the user. Theassociated devices information 31688 includes information regarding thedevice or devices involved in the event (e.g., a camera 118 thatrecorded the event). In some instances, the associated devicesinformation 31688 includes a link, pointer, or reference to a deviceprofile 3165 for the device.

The user profile 3163-j corresponds to a user j associated with thesmart home network (e.g., smart home network 202) such as a user of ahub device 204, a user identified by a hub device 204, a user whoreceives notifications from a hub device 204 or from the server system164, and the like. In some instances, the user profile 3163-j includesuser preferences 31631, user settings 31632, associated devicesinformation 31633, and associated events information 31634. In someinstances, the user profile 3163-j includes only a subset of the abovedata. In some instances, the user profile 3163-j includes additionaluser information not shown such as information regarding other usersassociated with the user j.

The user preferences 31631 include explicit user preferences input bythe user as well as implicit and/or inferred user preferences determinedby the system (e.g., server system 164 and/or client device 220). Insome instances, the inferred user preferences are based on historicaluser activity and/or historical activity of other users. The usersettings 31632 include information regarding settings set by the user jsuch as notification settings, device settings, and the like. In someinstances, the user settings 31632 include device settings for devicesassociated with the user j.

The associated devices information 31633 includes information regardingdevices associated with the user j such as devices within the user'ssmart home environment 100 and/or client devices 220. In some instances,associated devices information 31633 includes a link, pointer, orreference to a corresponding device profile 3165. Associated eventsinformation 31634 includes information regarding events associated withuser j such as events in which user j was identified, events for whichuser j was notified, events corresponding to user j's smart homeenvironment 100, and the like. In some instances, the associated eventsinformation 31634 includes a link, pointer, or reference to acorresponding event record 3168.

The device profile 3165-k corresponds to a device k associated with asmart home network (e.g., smart home network 202) such a hub device 204,a camera 118, a client device 220, and the like. In some instances, thedevice profile 3165-k includes device settings 31651, associated devicesinformation 31652, associated user information 31653, associated eventinformation 31654, and environmental data 31655. In some instances, thedevice profile 3165-k includes only a subset of the above data. In someinstances, the device profile 3165-k includes additional deviceinformation not shown such as information regarding whether the deviceis currently active.

The device settings 31651 include information regarding the currentsettings of device k such as positioning information, mode of operationinformation, and the like. In some instances, the device settings 31651are user-specific and are set by respective users of the device k. Theassociated devices information 31652 includes information regardingother devices associated with device k such as other devices linked todevice k and/or other devices in the same smart home network as devicek. In some instances, the associated devices information 31652 includesa link, pointer, or reference to a respective device profile 3165corresponding to the associated device.

The associated user information 31653 includes information regardingusers associated with the device such as users receiving notificationsfrom the device, users registered with the device, users associated withthe smart home network of the device, and the like. In some instances,the associated user information 31653 includes a link, pointer, orreference to a user profile 3163 corresponding to the associated user.

The associated event information 31654 includes information regardingevents associated with the device k such as historical events involvingthe device k. In some instances, the associated event information 31654includes a link, pointer, or reference to an event record 3168corresponding to the associated event.

The environmental data 31655 includes information regarding theenvironment of device k such as information regarding whether the deviceis outdoors or indoors, information regarding the light level of theenvironment, information regarding the amount of activity expected inthe environment (e.g., information regarding whether the device is in aprivate residence versus a busy commercial property), informationregarding environmental objects (e.g., depth mapping information for acamera), and the like.

FIG. 4 is a block diagram illustrating a representative smart device 204in accordance with some implementations. In some implementations, thesmart device 204 (e.g., any devices of a smart home environment 100,FIG. 1) includes one or more processing units (e.g., CPUs, ASICs, FPGAs,microprocessors, and the like) 402, one or more communication interfaces404, memory 406, communications module 442 with radios 440, and one ormore communication buses 408 for interconnecting these components(sometimes called a chipset). In some implementations, the userinterface 410 includes one or more output devices 412 that enablepresentation of media content, including one or more speakers and/or oneor more visual displays. In some implementations, the user interface 410also includes one or more input devices 414, including user interfacecomponents that facilitate user input such as a keyboard, a mouse, avoice-command input unit or microphone, a touch screen display, atouch-sensitive input pad, a gesture capturing camera, or other inputbuttons or controls. Furthermore, some smart devices 204 use amicrophone and voice recognition or a camera and gesture recognition tosupplement or replace the keyboard. In some implementations, the smartdevice 204 includes one or more image/video capture devices 418 (e.g.,cameras, video cameras, scanners, photo sensor units).

The built-in sensors 490 include, for example, one or more thermalradiation sensors, ambient temperature sensors, humidity sensors, IRsensors, occupancy sensors (e.g., using RFID sensors), ambient lightsensors, motion detectors, accelerometers, and/or gyroscopes.

The radios 440 enable one or more radio communication networks in thesmart home environments, and allow a smart device 204 to communicatewith other devices. In some implementations, the radios 440 are capableof data communications using any of a variety of custom or standardwireless protocols (e.g., IEEE 802.15.4, Wi-Fi, ZigBee, 6LoWPAN, Thread,Z-Wave, Bluetooth Smart, ISA100.5A, WirelessHART, MiWi, etc.) custom orstandard wired protocols (e.g., Ethernet, HomePlug, etc.), and/or anyother suitable communication protocol, including communication protocolsnot yet developed as of the filing date of this document.

The communication interfaces 404 include, for example, hardware capableof data communications using any of a variety of custom or standardwireless protocols (e.g., IEEE 802.15.4, Wi-Fi, ZigBee, 6LoWPAN, Thread,Z-Wave, Bluetooth Smart, ISA100.5A, WirelessHART, MiWi, etc.) and/or anyof a variety of custom or standard wired protocols (e.g., Ethernet,HomePlug, etc.), or any other suitable communication protocol, includingcommunication protocols not yet developed as of the filing date of thisdocument.

The memory 406 includes high-speed random access memory, such as DRAM,SRAM, DDR RAM, or other random access solid state memory devices; and,optionally, includes non-volatile memory, such as one or more magneticdisk storage devices, one or more optical disk storage devices, one ormore flash memory devices, or one or more other non-volatile solid statestorage devices. The memory 406, or alternatively the non-volatilememory within the memory 406, includes a non-transitory computerreadable storage medium. In some implementations, the memory 406, or thenon-transitory computer readable storage medium of the memory 406,stores the following programs, modules, and data structures, or a subsetor superset thereof:

-   -   operating logic 420 including procedures for handling various        basic system services and for performing hardware dependent        tasks;    -   a device communication module 422 for connecting to and        communicating with other network devices (e.g., network        interface 160, such as a router that provides Internet        connectivity, networked storage devices, network routing        devices, server system 164, etc.) connected to one or more        networks 162 via one or more communication interfaces 404 (wired        or wireless);    -   an input processing module 426 for detecting one or more user        inputs or interactions from the one or more input devices 414        and interpreting the detected inputs or interactions;    -   a user interface module 428 for providing and displaying a user        interface in which settings, captured data, and/or other data        for one or more devices (e.g., the smart device 204, and/or        other devices in smart home environment 100) can be configured        and/or viewed;    -   one or more applications 430 for execution by the smart device        (e.g., games, social network applications, smart home        applications, and/or other web or non-web based applications)        for controlling devices (e.g., executing commands, sending        commands, and/or configuring settings of the smart device 204        and/or other client/electronic devices), and for reviewing data        captured by devices (e.g., device status and settings, captured        data, or other information regarding the smart device 204 and/or        other client/electronic devices);    -   a device-side module 432, which provides device-side        functionalities for device control, data processing and data        review, including but not limited to:        -   a command receiving module 4320 for receiving, forwarding,            and/or executing instructions and control commands (e.g.,            from a client device 220, from a server system 164, from            user inputs detected on the user interface 410, etc.) for            operating the smart device 204;        -   a data processing module 4322 for processing data captured            or received by one or more inputs (e.g., input devices 414,            image/video capture devices 418, location detection device            416), sensors (e.g., built-in sensors 490), interfaces            (e.g., communication interfaces 404, radios 440), and/or            other components of the smart device 204, and for preparing            and sending processed data to a device for review (e.g.,            client devices 220 for review by a user); and    -   device data 434 storing data associated with devices (e.g., the        smart device 204), including, but is not limited to:        -   account data 4340 storing information related to user            accounts loaded on the smart device 204, wherein such            information includes cached login credentials, smart device            identifiers (e.g., MAC addresses and UUIDs), user interface            settings, display preferences, authentication tokens and            tags, password keys, etc.;        -   local data storage database 4342 for selectively storing raw            or processed data associated with the smart device 204            (e.g., video surveillance footage captured by a camera 118);    -   a bypass module 436 for detecting whether radio(s) 440 are        transmitting signals via respective antennas coupled to the        radio(s) 440 and to accordingly couple radio(s) 440 to their        respective antennas either via a bypass line or an amplifier        (e.g., a low noise amplifier); and    -   a transmission access module 438 for granting or denying        transmission access to one or more radio(s) 440 (e.g., based on        detected control signals and transmission requests).

Each of the above identified elements may be stored in one or more ofthe previously mentioned memory devices, and corresponds to a set ofinstructions for performing a function described above. The aboveidentified modules or programs (i.e., sets of instructions) need not beimplemented as separate software programs, procedures, or modules, andthus various subsets of these modules may be combined or otherwiserearranged in various implementations. In some implementations, thememory 406, optionally, stores a subset of the modules and datastructures identified above. Furthermore, the memory 406, optionally,stores additional modules and data structures not described above.

FIG. 5 illustrates a representative system architecture 500. In someimplementations, the server system 164 includes functional modules foran event processor 3146, an event categorizer 507, and a user-facingfrontend 3150. The event processor 3146 obtains the event candidates(e.g., by processing the video stream or by receiving the event startinformation from the video source 501). In some implementations, theevent candidates comprise motion event candidates. In someimplementations, the event candidates include audio and/or visualaspects. The event categorizer 507 categorizes the event candidates intodifferent event categories. The user-facing frontend 3150 generatesevent alerts and facilitates review of the events by a reviewer througha review interface on a client device 220. The user-facing frontend 3150also receives user edits on the event categories, user preferences foralerts and event filters, and zone definitions for zones of interest.The event categorizer optionally revises event categorization models andresults based on the user edits received by the user-facing frontend3150. The server system 164 also includes a video source data database509, event categorization models database 510, and event data and eventmasks database 511. In some implementations, each of these databases ispart of the server database 316 (e.g., part of data storage database3160).

The server system 164 receives one or more video stream(s) 504 from thevideo source 501 (e.g., a video source 222) and optionally receivesevent candidate information 502 such as event start information (e.g.,motion start information) and source information 503 such as devicesettings for a camera 118 (e.g., a device profile 3165 for camera 118).In some implementations, the event processor sub-module 3146communicates with the video source 501. The server system sends alertsfor events 512 and event timeline information 513 to the client device220. The server system 164 optionally receives user information from theclient device 220 such as edits on event categories 514 and zonedefinitions 515.

A data processing pipeline processes video information (e.g., a livevideo feed) received from a video source 501 (e.g., including a camera118 and an optional controller device) and/or audio information receivedfrom one or more smart devices in real-time to identify and categorizeevents occurring in the smart home environment, and sends real-timeevent alerts and a refreshed event timeline to a client device 220associated with a reviewer account for the smart home environment. Thedata processing pipeline also processes stored information (such asstored video feeds from a video source 501) to reevaluate and/orre-categorize events as necessary, such as when new information isobtained regarding the event and/or when new information is obtainedregarding event categories (e.g., a new activity zone is obtained fromthe user).

After video and/or audio data is captured at a smart device, the data isprocessed to determine if any potential event candidates are present. Insome implementations, the data is initially processed at the smartdevice (e.g., video source 501 or camera 118). Thus, in someimplementations, the smart device sends event candidate information,such as event start information, to the server system 164. In someimplementations, the data is processed at the server system 164 forevent start detection. In some implementations, the video and/or audiodata is stored on server system 164 (e.g., in video and source datadatabase 509). In some implementations, the video stream is stored on aserver distinct from server system 164. In some implementations, after amotion start is detected, the relevant portion of the video stream isretrieved from storage (e.g., from video and source data database 509).

In some implementations, the event identification process includessegmenting the video stream into multiple segments then categorizing theevent candidate within each segment. In some implementations,categorizing the event candidate includes an aggregation of backgroundfactors, entity detection and identification, motion vector generationfor each motion entity, entity features, and scene features to generatemotion features for the event candidate. In some implementations, theevent identification process further includes categorizing each segment,generating or updating an event log based on categorization of asegment, generating an alert for the event based on categorization of asegment, categorizing the complete event, updating the event log basedon the complete event, and generating an alert for the event based onthe complete event. In some implementations, a categorization is basedon a determination that the event occurred within a particular zone ofinterest. In some implementations, a categorization is based on adetermination that the event candidate involves one or more zones ofinterest. In some implementations, a categorization is based on audiodata and/or audio event characterization.

The event analysis and categorization process may be performed by thesmart device (e.g., the video source 501) and the server system 164cooperatively, and the division of the tasks may vary in differentimplementations, for different equipment capability configurations,and/or for different network and server load situations. After theserver system 164 categorizes the event candidate, the result of theevent detection and categorization may be sent to a reviewer associatedwith the smart home environment.

In some implementations, the server system 164 stores raw or compressedvideo data (e.g., in a video and source data database 509), eventcategorization models (e.g., in an event categorization model database510), and event masks and other event metadata (e.g., in an event dataand event mask database 511) for each of the video sources 222. In someimplementations, the video data is stored at one or more displayresolutions such as 480p, 780p, 1080i, 1080p, and the like.

In some implementations, the video source 501 (e.g., the camera 118)transmits a live video feed to the remote server system 164 via one ormore networks (e.g., the network(s) 162). In some implementations, thetransmission of the video data is continuous as the video data iscaptured by the camera 118. In some implementations, the transmission ofvideo data is irrespective of the content of the video data, and thevideo data is uploaded from the video source 501 to the server system164 for storage irrespective of whether any motion event has beencaptured in the video data. In some implementations, the video data maybe stored at a local storage device of the video source 501 by default,and only video portions corresponding to motion event candidatesdetected in the video stream are uploaded to the server system 164(e.g., in real-time).

In some implementations, the video source 501 dynamically determines atwhat display resolution the video stream is to be uploaded to the serversystem 164. In some implementations, the video source 501 dynamicallydetermines which parts of the video stream are to be uploaded to theserver system 164. For example, in some implementations, depending onthe current server load and network conditions, the video source 501optionally prioritizes the uploading of video portions corresponding tonewly detected motion event candidates ahead of other portions of thevideo stream that do not contain any motion event candidates; or thevideo source 501 uploads the video portions corresponding to newlydetected motion event candidates at higher display resolutions than theother portions of the video stream. This upload prioritization helps toensure that important motion events are detected and alerted to thereviewer in real-time, even when the network conditions and server loadare less than optimal. In some implementations, the video source 501implements two parallel upload connections, one for uploading thecontinuous video stream captured by the camera 118, and the other foruploading video portions corresponding to detected motion eventcandidates. At any given time, the video source 501 determines whetherthe uploading of the continuous video stream needs to be suspendedtemporarily to ensure that sufficient bandwidth is given to theuploading of the video segments corresponding to newly detected motionevent candidates.

In some implementations, the video stream uploaded for cloud storage isat a lower quality (e.g., lower resolution, lower frame rate, highercompression, etc.) than the video segments uploaded for motion eventprocessing.

As shown in FIG. 5, the video source 501 includes a camera 118, and anoptional controller device. In some implementations, the camera 118includes sufficient on-board processing power to perform all necessarylocal video processing tasks (e.g., cuepoint detection for motion eventcandidates, video uploading prioritization, network connectionmanagement, etc.), and the camera 118 communicates with the serversystem 164 directly, without any controller device acting as anintermediary. In some implementations, the camera 118 captures the videodata and sends the video data to the controller device for the necessarylocal video processing tasks. The controller device optionally performsthe local processing tasks for multiple cameras. For example, there maybe multiple cameras in one smart home environment (e.g., the smart homeenvironment 100, FIG. 1), and a single controller device receives thevideo data from each camera and processes the video data to detectmotion event candidates in the video stream from each camera. Thecontroller device is responsible for allocating sufficient outgoingnetwork bandwidth to transmitting video segments containing motion eventcandidates from each camera to the server before using the remainingbandwidth to transmit the video stream from each camera to the serversystem 164. In some implementations, the continuous video stream is sentand stored at one server facility while the video segments containingmotion event candidates are send to and processed at a different serverfacility.

In some implementations, the smart device sends additional sourceinformation 503 to the server system 164. This additional sourceinformation 503 may include information regarding a device state (e.g.,IR mode, AE mode, DTPZ settings, etc.) and/or information regarding theenvironment in which the device is located (e.g., indoors, outdoors,night-time, day-time, etc.). In some implementations, the sourceinformation 503 is used by the server system 164 to perform eventdetection and/or to categorize event candidates. In someimplementations, the additional source information 503 includes one ormore preliminary results from video processing performed by the camera118 (e.g., categorizations, object recognitions, motion masks, etc.).

In some implementations, the video portion after an event start incidentis detected is divided into multiple segments. In some implementations,the segmentation continues until event end information (sometimes alsocalled an “end-of-event signal”) is obtained. In some implementations,the segmentation occurs within the server system 164 (e.g., by the eventprocessor module 3146). In some implementations, the segmentationcomprises generating overlapping segments. For example, a 10-secondsegment is generated every second, such that a new segment overlaps theprior segment by 9 seconds.

In some implementations, each of the multiple segments is of the same orsimilar duration (e.g., each segment has a 10-12 second duration). Insome implementations, the first segment has a shorter duration than thesubsequent segments. Keeping the first segment short allows for realtime initial categorization and alerts based on processing the firstsegment. The initial categorization may then be revised based onprocessing of subsequent segments. In some implementations, a newsegment is generated if the motion entity enters a new zone of interest.

In some implementations, after the event processor module obtains thevideo portion corresponding to an event candidate, the event processormodule 3146 obtains background factors and performs motion entitydetection identification, motion vector generation for each motionentity, and feature identification. Once the event processor module 3146completes these tasks, the event categorizer 507 aggregates all of theinformation and generates a categorization for the motion eventcandidate. In some implementations, false positive suppression isoptionally performed to reject some motion event candidates before themotion event candidates are submitted for event categorization. In someimplementations, determining whether a motion event candidate is a falsepositive includes determining whether the motion event candidateoccurred in a particular zone. In some implementations, determiningwhether a motion event candidate is a false positive includes analyzingan importance score for the motion event candidate. The importance scorefor a motion event candidate is optionally based on zones of interestinvolved with the motion event candidate, background features, motionvectors, scene features, entity features, motion features, motiontracks, and the like.

In some implementations, the video source 501 has sufficient processingcapabilities to perform, and does perform, the background estimation,motion entity identification, the motion vector generation, and/or thefeature identification.

FIG. 6 is a block diagram illustrating a representative client device220 associated with a user account in accordance with someimplementations. The client device 220, typically, includes one or moreprocessing units (CPUs) 602, one or more network interfaces 604, memory606, and one or more communication buses 608 for interconnecting thesecomponents (sometimes called a chipset). Optionally, the client devicealso includes a user interface 610 and one or more built-in sensors 690(e.g., accelerometer and gyroscope). The user interface 610 includes oneor more output devices 612 that enable presentation of media content,including one or more speakers and/or one or more visual displays. Theuser interface 610 also includes one or more input devices 614,including user interface components that facilitate user input such as akeyboard, a mouse, a voice-command input unit or microphone, a touchscreen display, a touch-sensitive input pad, a gesture capturing camera,or other input buttons or controls. Furthermore, some the client devicesuse a microphone and voice recognition or a camera and gesturerecognition to supplement or replace the keyboard. In someimplementations, the client device includes one or more cameras,scanners, or photo sensor units for capturing images (not shown).Optionally, the client device includes a location detection device 616,such as a GPS (global positioning satellite) or other geo-locationreceiver, for determining the location of the client device.

The memory 606 includes high-speed random access memory, such as DRAM,SRAM, DDR SRAM, or other random access solid state memory devices; and,optionally, includes non-volatile memory, such as one or more magneticdisk storage devices, one or more optical disk storage devices, one ormore flash memory devices, or one or more other non-volatile solid statestorage devices. The memory 606, optionally, includes one or morestorage devices remotely located from one or more processing units 602.The memory 606, or alternatively the non-volatile memory within thememory 606, includes a non-transitory computer readable storage medium.In some implementations, the memory 606, or the non-transitory computerreadable storage medium of the memory 606, stores the followingprograms, modules, and data structures, or a subset or superset thereof:

-   -   an operating system 618 including procedures for handling        various basic system services and for performing hardware        dependent tasks;    -   a network communication module 620 for connecting the client        device 220 to other systems and devices (e.g., client devices,        electronic devices, and systems connected to one or more        networks 162) via one or more network interfaces 604 (wired or        wireless);    -   an input processing module 622 for detecting one or more user        inputs or interactions from one of the one or more input devices        614 and interpreting the detected input or interaction;    -   one or more applications 624 for execution by the client device        (e.g., games, social network applications, smart home        applications, and/or other web or non-web based applications)        for controlling devices (e.g., sending commands, configuring        settings, etc. to hub devices and/or other client or electronic        devices) and for reviewing data captured by the devices (e.g.,        device status and settings, captured data, or other information        regarding the hub device or other connected devices);    -   a user interface module 622 for providing and displaying a user        interface in which settings, captured data, and/or other data        for one or more devices (e.g., smart devices 204 in smart home        environment 100) can be configured and/or viewed;    -   a client-side module 628, which provides client-side        functionalities for device control, data processing and data        review, including but not limited to:        -   a hub device and device control module 6280 for generating            control commands for modifying an operating mode of the hub            device or the electronic devices in accordance with user            inputs; and        -   a data review module 6282 for providing user interfaces for            reviewing data processed by the server system 164; and    -   client data 630 storing data associated with the user account        and electronic devices, including, but not limited to:        -   account data 6300 storing information related to both user            accounts loaded on the client device and electronic devices            (e.g., of the video sources 222) associated with the user            accounts, wherein such information includes cached login            credentials, hub device identifiers (e.g., MAC addresses and            UUIDs), electronic device identifiers (e.g., MAC addresses            and UUIDs), user interface settings, display preferences,            authentication tokens and tags, password keys, etc.; and        -   a local data storage database 6302 for selectively storing            raw or processed data associated with electronic devices            (e.g., of the video sources 222, such as a camera 118).

Each of the above identified elements may be stored in one or more ofthe previously mentioned memory devices, and corresponds to a set ofinstructions for performing a function described above. The aboveidentified modules or programs (i.e., sets of instructions) need not beimplemented as separate software programs, procedures, modules or datastructures, and thus various subsets of these modules may be combined orotherwise rearranged in various implementations. In someimplementations, the memory 606, optionally, stores a subset of themodules and data structures identified above. Furthermore, the memory606, optionally, stores additional modules and data structures notdescribed above.

FIGS. 7A-7B are perspective views of the camera assembly 118 inaccordance with some implementations. FIG. 7A shows a first perspectiveview of the camera 118. As shown in FIG. 7A, the camera 118 includes ahead assembly 702, a base assembly 704, and a cable 714 (e.g., forpowering the camera 118 and/or transferring data between the camera 118and a second electronic device.). The head assembly 702 includes a frontface 706 and a casing 711 (also sometimes called a housing). In someimplementations, the casing 711 includes a metal shield configured toresist impacts. In some implementations, the casing 711 includes aplastic exterior configured to resist water and/or sun damage. Inaccordance with some implementations, the front face 706 has IRtransparent portions for IR illuminators, a visible and IR transparentportion 707 for an image sensor, and one or more semi-transparentportions (corresponding to an ambient light sensor and/or a status LED).In accordance with some implementations, the front face 706 alsoincludes apertures 708 and 710 for microphones. In accordance with someimplementations, the periphery of the front face 706 is configured todirect light from a light ring outward from the face of the camera 118.

In accordance with some implementations, the casing 711 includes anaperture 713 for a microphone and a plurality of apertures 712 for aspeaker. In some implementations, each aperture 708, 710, and 713includes a waterproof membrane configured to inhibit and/or preventwater from entering an interior of the camera 118.

In some implementations, the speaker apertures 712 extend directlyoutward from the speaker, which results in holes with an ellipticalouter surface. In some implementations, the speaker apertures 712 areparallel to one another. In some implementations, the speaker apertures712 extend outward at an angle consistent with the surface of the casing711 such that the holes have a circular, rather than elliptical, outersurface.

In some implementations, the casing 711 has two or more layers. In someimplementations, the inner layer is composed of a thermally conductiveresin. In some implementations, the outer layer is a structural jacketconfigured to protect the camera 118 from environmental conditions suchas moisture or electromagnetic charge (e.g., static electricity). Insome implementations, the structural jacket is configured to protect thecamera 118 from impacts, such as from a collision with another object(e.g., a baseball bat) or the ground.

FIG. 7B shows a back perspective view of the camera 118. As shown inFIG. 7B the cable 714 is insertable into the base assembly 704. Forexample, a user may store the cable 714 separately from the camera 118when desired. FIG. 7B also shows the screws 715 for affixing the baseassembly 704 to a surface (e.g., a wall or ceiling).

In some implementations, the camera assembly 118 is configured to havetwo or more degrees of freedom (e.g., pitch and yaw). FIGS. 8A-8D arecomponent views of the camera assembly 118 in accordance with someimplementations. FIG. 8A shows the head assembly 702 with the front face706 and the casing 711. FIG. 8A also shows an expanded view of the baseassembly 704, including ball assembly 802, hinge cradle 804, hingehousing 806, and base 808.

In some implementations, a ball assembly 802 is positioned against afirst friction surface of the hinge cradle 804 that is configured toabut against the ball assembly 802. In some implementations, a secondfriction surface is positioned and configured to abut against a secondportion of the ball assembly 802. In some implementations, firstfriction surface is positioned between the hinge housing 806 and theball assembly 802. In some implementations, the first friction surfaceand the second friction surface are made of the same materials. In otherimplementations, the first friction surface and the second frictionsurface are made of different materials selected, for example, to havedifferent coefficients of friction. For example, in someimplementations, the second friction surface is selected to have a lowercoefficient of friction than the first friction surface. In otherimplementations, the second friction surface is selected to have ahigher coefficient of friction than the first friction surface. In someimplementations, the surface of the ball assembly 802 is made from ametal or metal alloy and the first and second friction surfaces are madefrom plastic or thermoplastic materials. The surface of the ballassembly 802 and/or the first and second friction surfaces are made frommaterials with relatively low wear rates or high durability according tosome implementations. In some implementations, the surface of the ballassembly 802 is treated to create a desired amount of friction. Forexample, in some implementations, the surface of the ball assembly 802is textured, for example, by abrasive blasting, etching, etc. In someimplementations, the surface of the ball assembly 802 is chemicallytreated, for example, anodized to create an oxide surface layer orelectroplated. In some implementations, the surface of the ball assembly802 is made from an aluminum alloy, for example, 6063 aluminum alloy,which has been abrasive blasted and/or anodized.

The first and second friction surfaces are optionally made frommaterials which are different than the material used to form the surfaceof the ball assembly 802. In some implementations, the first and secondfriction surfaces are made from polymeric materials or compositematerials. In some implementations, the first and second frictionsurfaces are made from relatively low friction materials. In someimplementations, use of low friction materials allow for smoothermovement of the head assembly 702 about the surface of the ball assembly802. For example, in some implementations, the first and/or secondfriction surfaces include polyoxymethylene or acetal resins (e.g.,available under the tradename DELRIN®). In some implementations, thefirst and/or second friction surfaces include polytetrafluoroethylene(PTFE) or PTFE incorporated into other polymers (e.g, acetal resinsimpregnated with PTFE fibers).

In some implementations, the hinge assembly of the present invention isarranged to further conceal cables (e.g., coupling to connector 714)connecting to the electronic device in head assembly 702. In someimplementations, an external power/data cable such as the connector 714is routed into a mounting plate through either a lateral or bottomopening. The connector 714 is, in some implementations, a USB cablehaving, for example, a USB 2.0 plug, USB 3.0 plug, USB type-A plug, USBtype-B plug, USB type-C plug, mini-USB plug, or micro-USB plug. In someimplementations, the base assembly 704 includes a receptacle forreceiving and an electronically connecting with the plug of theconnector 714. In some implementations, the receptacle is a component ofthe base assembly 704. In some such implementations, the receptacle ishoused within a stem of the base assembly 714. In some implementations,the stem includes a lumen 202 into which the plug of the connector 714may be inserted to reach the receptacle. In some implementations, theplug of the connector 714 includes an outer gasket configured to make aliquid-tight seal against the walls of the lumen when the plug isinserted therein to prevent water from leaking into the camera 118. Insome implementations, the receptacle is located at an end of the stemand positioned within the ball assembly 802. In some implementations,the receptacle may in turn be positioned on or electrically connected toa printed circuit board (PCB) that may also be positioned and securedwithin the ball assembly 802. The PCB may include, for example,electronic circuitry which is in electronic communication with andconfigured to receive signals from and/or transmit signals to thereceptacle and the connector 714. In some implementations, the PCB mayinclude a power converter (e.g., a buck converter or DC-to-DC step downconverter). In some implementations, a voltage is input into camera 118from the connector 714, and the power converter is configured to stepdown the input voltage.

In some implementations, the camera assembly 118 is configured to beinstalled to a mounting plate 826 without the need for a specific tool.In some implementations, the camera assembly 118 is configured torequire a specific tool to be uninstalled from the mounting plate 826.With reference now to FIGS. 8B-8D, the camera 118, in someimplementations, includes an attachment mechanism generally designated809 which is configured to secure the base assembly 704 onto a mountingplate 826. In some implementations, the attachment mechanism 809 isconfigured to releasably secure the base assembly 704 onto the mountingplate 826. In some implementations, the base assembly 704 is secured tothe mounting plate 826 through a first motion by a user of the device,and unsecured from the mounting plate through a second motion by theuser. The second motion, in some implementations, is different than thefirst motion and/or different than a reverse of the first motion. Insome implementations, for example, the base assembly 704 is configuredto be securely engaged with the mounting plate 826 by pressing the baseassembly 704 into the mounting plate 826 in a linear motion along afirst direction that is, or substantially is, perpendicular to a backsurface 828, whereas the base assembly 704 is configured to bedisengaged from the mounting plate 826 through a different second motion(e.g., a rotational motion). In some implementations, the attachmentmechanism 809 is configured to allow the base assembly 704 to besecurely engaged to the mounting plate 826 without the need or use ofany tools. In some implementations, the attachment mechanism 809 isconfigured to allow the base assembly 704 to be disengaged from themounting plate 826 only through the use of one or more separate tools.In some implementations, the attachment mechanism 809 is configured toallow the base assembly 704 to form a snap-fit engagement with themounting plate 806. In some implementations, the attachment mechanism ispositioned on the base assembly 704 and configured to engage with afeature of the mounting plate 806. In some such implementations, theattachment mechanism 809 is positioned on a mounting surface 812 of thebase assembly 704 which is opposite of an external surface 834. Incertain alternative implementations, the attachment mechanism 809 ispositioned on the mounting plate 826 and configured to engage with afeature of the base assembly 704. In some implementations, theattachment mechanism 809 is completely positioned and/or concealedbetween the external surface 834 of the base assembly and the backsurface 828 of the mounting plate 826 when the base assembly 704 issecurely engaged with the mounting plate 826.

In certain implementations, attachment mechanism 809 includes a firstarm 848 which is mounted onto the base assembly 704 and rotatable abouta first pivot. First arm 848 may be configured to rotate about firstpivot in a plane that is parallel to mounting surface 142. In someimplementations, a first biasing member is further positioned andconfigured to bias first arm 848 in a first rotational direction aboutfirst pivot. First biasing member may be a spring, for example, acompression spring, torsion spring, leaf spring, cantilever spring, etc.In some implementations, first arm 848 includes an the engagement edge844 which is configured to contact a portion of the mounting plate 826when the base assembly 704 is being engaged with the mounting plate 826.As discussed, in some implementations, the base assembly 704 may beengaged with the mounting plate 826 by aligning the one or more keyedfeatures of the mounting plate 826 (e.g., keyed surfaces 130) with thecorresponding features of the base assembly 704 (e.g., correspondingsurfaces 132) and linearly translating the base assembly 704 towards themounting plate 826 in a direction that is substantially perpendicular toback surface 134.

In some implementations, during engagement of the base assembly 704 withthe mounting plate 826, an engagement edge 844 is configured to contactan inner wall 842 of the mounting plate 826 which surrounds, at leastpartially, an opening 822. In some implementations, the inner wall 842includes a lip 836 which partially defines a groove 846 along an outersurface of the inner wall 842 which is sized to receive a first arm 848.In some implementations, the first arm 848 is configured to snap fitaround the lip 836 and the groove 846. In some implementations, theengagement edge 844 is configured to contact the lip 836 which in turncauses the first arm 848 to rotate about a first pivot and allow thefirst arm 848 to move past the lip 836 and be received within the groove846 as the base assembly 704 is engaged with the mounting plate 826. Insome such implementations, the engagement edge 844 includes a beveled orchamfered surfaced that is shaped and configured to translate a forceimpinging on the beveled or chamfered surface into a lateral force tomove the first arm 848 in a second rotational direction about firstpivot that is opposite the first rotational direction. In someimplementations, the lip 836 also includes a beveled or radiused edgewhich is configured to contact the beveled or chamfered surface of theengagement edge 844 and help guide the first arm 848 past the lip 836. Afirst biasing member, in some implementations, biases the first arm 848into the groove 846 once the first arm 848 moves past the lip 836. Insome implementations, the base assembly 704 is securely engaged with themounting plate 826 when the first arm 848 is received within the groove846. The lip 836, in some implementations, interlocks with the first arm848 when the first arm 848 is received within the groove 846 to preventthe base assembly 704 from disengaging with the mounting plate 826.

In some implementations, the attachment mechanism 809 further includes asecond arm 838. In some implementations, the second arm 838 operates inconcert with the first arm 848 to clamp onto a projection on themounting plate 826, for example, the inner wall 842. In someimplementations, the first arm 848 and the second arm 838 are configuredto counter-rotate with respect to each other. The second arm 838 may beconfigured to rotate about a second pivot in a plane that is parallel tomounting surface 142. In some implementations, a second biasing memberis further positioned and configured to bias the second arm 838 in afirst rotational direction about the second pivot. In someimplementations, the second biasing member is configured to bias thesecond arm 838 toward the first arm 848, and the first biasing member isconfigured to bias the first arm 848 toward the second arm 838. Thesecond biasing member may be a spring, for example, a compressionspring, torsion spring, leaf spring, cantilever spring, etc. In someimplementations, the second arm 838 further includes an engagement edge840 which is configured to contact a portion of the mounting plate 826when the base assembly 704 is being engaged with the mounting plate 826.

In some implementations, during engagement of the base assembly 704 withthe mounting plate 826, the engagement edge 840 of the second arm 838 isconfigured to contact the inner wall 842 of the mounting plate 826. Insome implementations, the groove 846 is sized to receive the second arm838. In some implementations, the second arm 838 is configured to snapfit around the lip 836 and the groove 846. In some implementations, theengagement edge 840 is configured to contact the lip 836 which in turncauses the second arm 838 to rotate about the second pivot and allow thesecond arm 838 to move past the lip 836 and be received within thegroove 846 as the base assembly 704 is engaged with the mounting plate826. In some such implementations, the engagement edge 840 includes abeveled or chamfered surfaced that is shaped and configured to translatea force impinging on the beveled or chamfered surface into a lateralforce to move the second arm 838 in a second rotational direction aboutfirst pivot that is opposite the first rotational direction. Thus, insome implementations, the lip 836 is configured to move the second arm838 and the first arm 848 away from each other as the base assembly 704is engaged with the mounting plate 826. In some implementations, the lip836 may also include a beveled or radiused edge which is configured tocontact the beveled or chamfered surface of the engagement edge 840 andhelp guide the second arm 838 past the lip 836. The second biasingmember may bias the second arm 838 into the groove 846 once second arm838 moves past lip 836 according to some implementations. In someimplementations, the base assembly 704 is securely engaged with themounting plate 826 when both the first arm 848 and the second arm 838are received within the groove 846. The lip 836, in someimplementations, interlocks with the first arm 848 and the second arm838 when the first arm 848 and the second arm 838 are received withinthe groove 846 to prevent the base assembly 704 from disengaging withthe mounting plate 826.

In some implementations, the attachment mechanism 809 further includes arelease mechanism that is configured to move the first arm 848 and/orthe second arm 838 out of the groove 846 to allow the base assembly 704to be disengaged from the mounting plate 826. In some implementations,the release mechanism may be accessed by a user through an opening inthe external surface 834 of the base assembly 704. In someimplementations, the release mechanism requires a separate tool to beinserted into the opening in order to be actuated. In someimplementations, the release mechanism requires the tool to be insertedinto opening and rotated. Similar to a security screw, opening in someimplementations may be shaped such that only a tool having a specificpredetermined shape (e.g., specific cross-sectional shape) may fit inopening and actuate the release mechanism. Requiring a specific shapefor the tool, particularly a less common shape, may help preventunauthorized removal of the base assembly 704 from the mounting plate826 according to some implementations. In some implementations, therelease mechanism may be designed to require a wrench or driver havingone of, for example, a hex, torx, square, triangular, pentalobe,polydrive, torq-set, or any other shape known for driving securityscrews. In some implementations, the tool must be a hex key. In someimplementations, the opening is configured such that a flathead orPhillips screw driver will not be able to actuate the release mechanism.In some implementations, the release mechanism is coupled to a radioand/or wired connector and is responsive to commands received via theradio and/or wired connector. For example, the release mechanism iscoupled to a radio configured to wirelessly communicate with a securitykey fob or similar device. In another example, the radio is configuredto wirelessly communicate with one or more user devices via a smart homeapplication.

FIGS. 9A-9D are component views of the camera assembly 118 in accordancewith some implementations. FIG. 9A shows an interior view of the camera118 in accordance with some implementations. As shown in FIG. 9A, thecamera 118 includes the front face 706, an image sensor assembly 902positioned behind the front face 706, and a speaker assembly 904positioned adjacent to the speaker apertures 712 in the casing 711.

In some implementations, the camera 118 is a video streaming device withpowerful computing capability embedded in the device. Therefore, in someinstances, it will consume a lot of power and will also generate a lotof heat. In order to prevent the chipset and other components from beingdamaged by the heat, a thermal relief solution includes directing theheat from the CPU (e.g., a CPU of the SoC 1322) to the speaker assembly904. In some implementations, the speaker assembly 904 is composed of athermally conductive plastic that is structurally suitable and has goodheat spreading properties. In some implementations, a thermal pad on topof the shield 1326 (FIG. 13C) is used to direct the heat to the speakerassembly.

In some implementations, the image sensor assembly 908 includes one ormore of: a circuit board (e.g., a PCB board), an IR cut filter, a lensholder, and an image sensor. In some implementations, the image sensorcomprises a 4k image sensor. In some implementations, the image sensorcomprises a 12 megapixel sensor. In some implementations, the imagesensor comprises a wide-angle lens.

In some implementations, the speaker assembly 904 includes a speaker anda heat sink. In some implementations, the heat sink is configured todissipate heat generated at the speaker and one or more circuit boardswithin the camera 118. In some implementations, the speaker assembly 904acts as a heat sink for the camera's system-on-a-chip (SoC) 1322, shownin FIG. 13C. In some implementations, the SoC 1322 is thermally coupledto the speaker assembly 904.

Turning now to FIGS. 9B-9D, the camera 118 in some implementationsincludes a hinge assembly having a ball assembly 912 about which thehead assembly 702 may be configured to rotate in two or more degrees offreedom. In some implementations, the ball assembly 912 is coaxial withand rigidly fixed to the stem 916. In some implementations, the ballassembly 912 includes a spherically curved convex bearing surface 940that is radially symmetric about an axis which is coaxial with an axisof the stem 916. In some implementations, the ball assembly 912 ispositioned partially within the casing 711 of the head assembly 702. Insome implementations, the ball assembly 912 may be disposed around atleast a portion of the stem 916. In some implementations, the headassembly 702 is configured to rotate about one or more axes which passthrough the center of the ball assembly 912. In some implementations,the head assembly 702 may be configured to tilt with respect to the stem916 about the ball assembly 912 in a first degree of freedom such thatthe central axis of the head assembly 702 (e.g., the optical axis) formsan angle with respect to the axis of the stem 916 from 0° (where thecentral axis of the head assembly 702 is coaxial with the axis of thestem 916) up to, for example, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°,85°, or 90° (where the central axis of the head assembly 702 isperpendicular to the axis of the stem 916). In further implementations,the head assembly 702 is configured to rotate about an axis of the ballassembly 912 which is coaxial with the axis of the stem 916 in a seconddegree of freedom. In some implementations, the head assembly 702 isconfigured to be able rotate about the axis of the stem 916 while thehead assembly 702 is tilted with respect to the axis of the stem 916.

In certain implementations, the ball assembly 912 may be positioned atleast partially within a collar 814, which is coupled to the headassembly 702 at a position that is opposite of the front face 706. Insome implementations, the collar 814 is disposed about at least aportion of the stem 916. In some implementations, the collar 814 isconfigured to move with the head assembly 702 when the head assembly 702is tilted and/or rotated about the ball assembly 912. In someimplementations, the collar 814 includes a cutout 810 (best whichprovides a clearance for the stem 916 when the head assembly 702 istilted with respect to the stem 916. In further implementations, thehead assembly 702 is configured to rotate with respect to the collar814. In some implementations, the head assembly 702 is configured torotate with respect to the collar 814 about the central axis of the headassembly 702 to allow for the clocking motion in a third degree offreedom. In some implementations a low friction liner 942 may beprovided between collar 814 and the head assembly 702 to provide smoothrotation between the head assembly 702 and collar 814. The low frictionliner 942, for example, may be a washer disposed around a portion ofcollar 814 and made from a low friction polymer, for example, afluoropolymer such as polytetrafluoroethylene (PTFE).

In some implementations, the head assembly 702 may be rotated about theball assembly 912 manually by the user without the use of or need foradditional tools. In some embodiments, after the camera 118 has beenaffixed to a wall or other desired surface, the head assembly 702 may berotated about the ball assembly 912 by a user using only a single hand.In further implementations, the hinge assembly is configured to maintainthe head assembly 702 in the desired position and orientation set by theuser without the need for the user to engage a separate clamping orlocking mechanism (e.g., set screws). In some implementations, frictionbetween bearing surface 940 of the ball assembly 912 and one or moreother components is at least sufficient to maintain the position of thehead assembly 702 with respect to the ball assembly 912 such that, forexample, the weight of the head assembly 702 will not cause the headassembly 702 to drift or move away from the position set by the user. Insome such implementations, the ball assembly 912 may be positionedbetween two or more surfaces configured to abut against bearing surface940 with sufficient force to maintain the head assembly 702 in positionwith respect to the ball assembly 912 until, for example, an additionalforce greater than the frictional force and/or greater than thefrictional force and weight of the head assembly 702 is applied to thehead assembly 702 (e.g., by the user). In some implementations, thehinge assembly includes one or more biasing elements (e.g., springs)that are positioned and configured to bias the two or more surfacesagainst bearing surface 940 to generate the sufficient frictional force.

In some implementations the ball assembly 912 may be positioned againsta first friction surface 944 that is configured to abut against a firstportion of bearing surface 940 (e.g. on a first hemisphere of the ballassembly 912). In further implementations, a second friction surface 938may be positioned and configured to abut against a second portion ofbearing surface 940 (e.g., on a second hemisphere of the ball assembly912). In some implementations, the first friction surface 944 ispositioned between collar 814 and the ball assembly 912. In someimplementations, the first friction surface 944 and the second frictionsurface 938 may be made of the same materials. In other implementations,the first friction surface 944 and the second friction surface 938 maybe made of different materials selected, for example, to have differentcoefficients of friction. For example, in some implementations, thesecond friction surface 938 may be selected to have a lower coefficientof friction than the first friction surface 944. In otherimplementations, the second friction surface 938 may be selected to havea higher coefficient of friction than the first friction surface 944. Insome implementations, bearing surface 940 may made from a metal or metalalloy and first and second friction surfaces may be made from plastic orthermoplastic materials. Preferably, bearing surface 940 and/or firstand second friction surfaces are made from materials with relatively lowwear rates or high durability according to some implementations. In someimplementations, bearing surface 940 may be treated to create a desiredamount of friction. For example, in some implementations, bearingsurface 940 may be textured, for example, by abrasive blasting, etching,etc. In some implementations, bearing surface 940 maybe chemicallytreated, for example, anodized to create an oxide surface layer orelectroplated. In one example implementation, bearing surface 940 may bemade from an aluminum alloy, for example, 6063 aluminum alloy, which hasbeen abrasive blasted and/or anodized.

The first and second friction surfaces may be made from materials whichare different than the material used to form bearing surface 940. Insome implementations, the first and second friction surfaces are madefrom polymeric materials or composite materials. In someimplementations, the first and second friction surfaces may be made fromrelatively low friction materials. In some implementations, use of lowfriction materials may allow for smoother movement of the head assembly702 about bearing surface 940. For example, in some implementations,first and/or second friction surfaces may include polyoxymethylene oracetal resins (e.g., available under the tradename DELRIN®). In someimplementations, the first and/or second friction surfaces may includepolytetrafluoroethylene (PTFE) or PTFE incorporated into other polymers(e.g, acetal resins impregnated with PTFE fibers).

In order to create the necessary frictional force with the use of lowfriction materials for the first and/or second friction surfaces, abiasing element 924 may be provided according to some implementationswhich is configured to increase the contact force or normal forcebetween bearing surface 940 of the ball assembly 912 and the firstand/or second friction surfaces. In some implementations, the biasingelement 924 is a spring (e.g., a compression or coil spring) which ispositioned to press the second friction surface 938 against bearingsurface 940. In some implementations, the second friction surface 938 isat least partially positioned between the biasing element 924 and theball assembly 912. In some implementations, biasing element is acompression spring that is disposed within the casing 711 and around thecentral axis of the head assembly 702 (e.g., the optical axis). In someimplementations, the biasing element 924 is configured to provide acontinuous spring force in a direction that is parallel to or coaxialwith the central axis of the head assembly 702. In some implementations,the biasing element 924 is arranged and positioned to continuouslyprovide a spring force toward the ball assembly 912 of at least 180 N,at least 190 N, at least 200 N, at least 210 N, at least 220 N, at least230 N, at least 240 N, at least 250 N, at least 260 N, at least 270 N,at least 280 N, at least 290 N, or at least 300 N. In someimplementations, the biasing element 924 is arranged and positioned tocontinuously provide a spring force toward the ball assembly 912 between180 N and 300 N, between 190 N and 290 N, between 200 N and 280 N,between 210 N and 270 N, between 220 N and 260 N, or between 230 N and250 N.

In some implementations, a communication board is connected to one ormore interconnect wires arranged in a cable bundles 906, 922 that may beconfigured to transmit power and/or data signals between communicationboard and the one or more components in the head assembly 702 (e.g., themain board 1016). In some implementations, cable bundles 906,922 may berouted from communication board in ball assembly 912 and at leastpartially through biasing element 924, generally along the central axisof head assembly 702. In some implementations, cable bundles 906,922 mayhave a length to provide enough slack to accommodate the movement ofhead assembly 702 with respect to ball assembly 912, for example, thetilting of head assembly 702.

In some implementations, the cable bundle 906 connects to thecommunication board via connector 992. In some implementations, thecable bundle 922 is in electrical communication with electronics of headassembly 702 via connector 990. In some implementations, cable bundles906 and 922 are coupled via a rotary electrical joint or slip ringconnection (e.g., composed of ring assembly 930 and brush elements 934)to electrically connect cable bundle 906 with cable bundle 922 whilefurther allowing the cable bundle 906 to rotate with respect to thecable bundle 922. In some implementations, the slip ring connectionallows the head assembly 702 to rotate with respect to ball assembly 912without cable bundles becoming impinged or severely twisted. In someimplementations, the slip ring connection includes a ring assembly 930having one or more ring-shaped electrical contacts electricallyconnected to the wires in the cable bundle 906. The slip ringconnection, in some implementations, also includes one or moreconductive brush elements 934 electrically connected to the wires in thecable bundle 922 and which are configured to touch and make electricalcontact with the one or more ring-shaped electrical contacts of ringassembly 930. The brush elements 934 include, in some implementations,biasing elements configured to bias the brush elements against the oneor more ring-shaped electrical contacts of ring assembly 930. The brushelements 934 are preferably configured to maintain electrical contactwith the ring assembly 930 even as ring assembly 930 rotates withrespect to the brush elements 934. In some implementations, the slipring connection may be positioned within the biasing element 924. Insome implementations, the slip ring connection is positioned within atube which extends through biasing element 924. In some suchimplementations, slip ring connection may be further covered by asealing element to provide a liquid-tight seal around slip ringconnection to help prevent the flow of water into head assembly throughthe tube.

FIGS. 10A-10B are additional component views illustrating arepresentative camera assembly in accordance with some implementations.As shown in FIGS. 10A-10B, the camera assembly 118 includes the frontface 706, a sealing ring 1040, a ring guide 1038, an illuminatorassembly 1036, the image sensor assembly 902, a sensor heatsink 1026,sensor shielding 1032, sensor pressure material 1030, a sensor pressureplate 1028, and a front face snap ring 1034. In some implementations,the sealing ring 1040 and the ring guide 1038 are configured to preventwater from entering the camera assembly between the casing 711 and thefront face 706. In some implementations, the illuminator assembly 1036includes a plurality of RGB LEDs (e.g., 4, 6, or 8 LEDs). In someimplementations, the illuminator assembly 1036 includes a status LEDand/or an ambient light sensor. In some implementations, the front facesnap ring 1034 is configured to attach to the front face 706. In someimplementations, the front face snap ring 1034 is configured to attachto the front face 706 via a snapping motion. In some implementations,the front face snap ring 1034 is configured to engage the front face 706via a snapping mechanism. In some implementations, the front face snapring 1034 is configured to detach from the front face 706 via a twistingmotion.

In some implementations, the image sensor assembly 902 includes anactive heating module (e.g., a heating sticker). In someimplementations, the active heating module is attached to an outsidesurface of the sensor heatsink 1026, such that, when active, the heatingmodule heats the image sensor through the sensor heatsink 1026. In someimplementations, the active heating module is attached to an interiorsurface of the sensor heatsink 1026 such that the active heating moduleis enabled to heat the image sensor directly. In some implementations,the active heating module is affixed to an image sensor board of theimage sensor assembly 902.

In some implementations, the image sensor comprises a fixed-focus imagesensor and the active heating module is configured to maintain thefixed-focus image sensor at temperatures that minimize a temperatureimpact on sharpness and/or focus of the fixed-focus image sensor. Insome implementations, the active heating module is configured tomaintain the image sensor at a target operating temperature so as tooptimize sharpness during operation.

In some implementations, the active heating module is coupled to one ormore temperature sensors (e.g., temperature sensors located on the imagesensor assembly 902, the illuminator assembly 1036, and/or the mainboard 1016). In some implementations, the active heating module isaffixed to a side of the image sensor and is enclosed by the sensorheatsink 1026. In some implementations, the active heating module isconfigured to maintain the image sensor at temperatures within apreferred temperature range (e.g., 50 degrees Fahrenheit to 70 degreesFahrenheit) while the image sensor is in operation. In someimplementations, the active heating module is configured to provide heatin the range of 20 degrees Fahrenheit to 30 degrees Fahrenheit to theimage sensor. In some implementations, the active heating module iscommunicatively coupled to the main board 1016 and/or an image sensorboard of the image sensor assembly 902.

In some implementations, the active heating module determines anoperating temperature cycle for the image sensor (e.g., a 24 hourtemperature cycle). In some implementations, the active heating moduleutilizes the determined temperature cycle to pre-emptively adjust thetemperature of the image sensor. In some implementations, the activeheating module does not comprise any moving parts and therefore is morerobust and cheaper than an auto-focus system.

In some implementations, the optimal temperature differs for differentcameras 118 and is determined on a per-device basis. In someimplementations, the active heating module determines the optimaloperating temperature for the image sensor by recording systemtemperature and image sharpness (of the current scene) through at leastone thermal cycle. In some implementations, the thermal cyclecorresponds to a 24-hour period. In some instances, the relationshipbetween the temperature and sharpness is a parabola. The optimaltemperature is thus determined by selecting the temperature at the peakof the parabola (e.g., at peak sharpness). In some implementations, theoptimal temperature is determined after the camera 118 has beeninstalled in the smart home environment 100.

In some implementations, the front face 706 comprises achemically-strengthened glass. In some implementations, the front face706 comprises a soda-lime glass (e.g., the inner portion of the frontface 706 corresponding to the field of view of the image sensor).

In some implementations, the sensor heatsink 1026 is composed ofmagnesium. In some implementations, the sensor heatsink 1026 is adaptedto dissipate heat from the image sensor assembly 902. In someimplementations, the sensor heatsink 1026 is adapted to providestructural support to the camera 118. In some implementations, thesensor heatsink 1026 is adapted to protect the image sensor assembly 902from environmental forces such as moisture and/or impact from objectsand/or the ground. In some implementations, the sensor heatsink 1026 isconfigured to affix the image sensor assembly 902 to the front face 706.In some implementations, the sensor heatsink 1026 is configured toinhibit electromagnetic interference with the image sensor assembly 902(e.g., from the antenna ring 1024).

In some implementations, the sensor pressure plate 1028 is configured toprovide constant pressure on the image sensor assembly 902 against thefront face 706 to increase adhesive effectiveness and waterproofing. Insome implementations, the sensor heatsink 1026 and the sensor pressureplate 1028 are configured to provide constant pressure on the imagesensor assembly 902 against the front face 706. In some implementations,the sensor pressure material 1030 is configured to inhibitelectromagnetic interference with the image sensor assembly 902. In someimplementations, the sensor pressure material 1030 is configured totransfer heat from the image sensor assembly 902 to the sensor heatsink1026.

In some implementations, the sensor shielding 1032 is configured toinhibit electromagnetic interference with the image sensor assembly 902.In some implementations, the sensor shielding 1032 is configured to(e.g., in conjunction with the sensor heatsink 1206) reduce and/oreliminate radio frequency (RF) interference with the image sensorassembly 902 (e.g., from one or more antennas of the camera assembly118). In some implementations, the sensor shielding 1032 is adapted asdesense shielding for the image sensor 902.

As shown in FIGS. 10A-10B, the camera assembly 118 further includes anantenna ring 1024, a main heatsink 1022, shielding material 1020 (e.g.,shielding foam), thermal material 1018, a main board 1016, the speakerassembly 904, the biasing element 924 (e.g., a hinge spring), a sealingring 1010, an inner housing 1002, a microphone 1008, a microphonemembrane 1006, a speaker seal 1004, and the casing 711.

In some implementations, the thermal material 1018 is adapted tothermally couple the inner layer 1002 and the main heatsink 1022 to thecasing 711. In some implementations, the thermal material 1018 iscomposed of a metal or metal alloy. In some implementations, the thermalmaterial 1018 is composed of one or more thermal pads.

In some implementations, the antennas ring 1024 includes a plurality ofantennas (e.g., 2, 3, or 4 antennas). In some implementations, theantennas ring 1024 includes a plurality of antennas equidistance fromone another. In some implementations, the antennas ring 1024 is composedof metal or a metal alloy. In some implementations, the shieldingmaterial 1020 is configured to inhibit signal interference between thecomponents on the main board 1016 (e.g., the SoC) and the antennas onthe antenna ring 1024. In some implementations, the shielding material1020 is configured to isolate RF signals of the main board componentsfrom the antennas.

In some implementations, the antennas are configured to enable thecamera 118 to wirelessly communication with one or more other electronicdevices, such as a hub device 180, a smart device 204, and/or a serversystem 164. In some implementations, the plurality of antennas isconfigured to operate concurrently using two distinct frequencies. Insome implementations, the plurality of antennas is configured to operateconcurrently using two distinct communication protocols. In someimplementations, one or more of the antennas is configured for broadbandcommunications (e.g., Wi-Fi) and/or point-to-point communications (e.g.,Bluetooth). In some implementations, one or more of the antennas isconfigured for mesh networking communications (e.g., ZWave). In someimplementations, a first antenna of the plurality of antennas isconfigured for 2.4 GHz Wi-Fi communication and a second antenna of theplurality of antennas is configured for 5 GHz Wi-Fi communication. Insome implementations, a first antenna of the plurality of antennas isconfigured for 2.4 GHz Wi-Fi communication and point-to-pointcommunication, a second antenna of the plurality of antennas isconfigured for 5 GHz Wi-Fi communication and point-to-pointcommunication, and a third antenna of the plurality of antennas isconfigured for mesh networking communication. In some implementations,two or more of the antennas are configured to transmit and/or receivedata concurrently with others of the antennas.

MIMO (multi input multi output) provides the benefit of greaterthroughput and better range for the wireless communication. One of theparameters in the antenna system is the isolation between two antennas.Better isolation can ensure the data transmitted through two antennasare uncorrelated which is the key to the MIMO system. One way to achievegood isolation is to have large antenna separations. However, in modernconsumer electronics the space left for antennas is very tight so havingenough spacing between antennas is infeasible. While isolation isimportant, the antenna efficiency cannot be sacrificed.

Isolation is directly related to how much energy is coupled from oneantenna to another. The Friis equation defines the power received byanother antenna as inversely proportional to (1/R){circumflex over( )}2, where R is the distance between two antennas. So increasingantenna spacing is one effective way to achieve good isolation. Anothermeans to achieve isolation is through use of a decoupling network. Forexample, an artificial coupling channel is generated in additional toits original coupling channel (e.g., which is through air). By properlymanaging the two coupling channels, the good isolation can be achieved.

In some implementations, the antennas include at least one dual-bandInverted-F Antenna (IFA). In some implementations, the antennas are madeby FPC, LDS, Stamping, or other state of art antenna manufacturingtechnology. In some implementations, the illuminator assembly 1036 isconfigured to provide an electrical ground for one or more of theantennas. In some implementations, the illuminator assembly 1036includes a plurality of electrically-conductive contacts 1037 configuredto contact the antenna ring 1024 and inhibit interference betweenantennas of the antenna ring 1024. In some implementations, theplurality of electrically-conductive contacts comprises a plurality ofmetallic protrusions along a backside of the illuminator assembly 1036.In some implementations, the plurality of electrically-conductivecontacts 1037 is configured to contact an electrical ground of theantenna ring 1024.

In some implementations, the main heatsink 1022 is configured to providestructural support for the camera assembly 118 (e.g., to be resistant toimpact from objects and/or the ground). In some implementations, themain heatsink 1022 is configured to dissipate heat to the casing 711. Insome implementations, the main heatsink 1022 is configured to dissipateheat from the main board 1016 to the casing 711. In someimplementations, the main board 1016 is configured to mount to the mainheatsink 1022. In some implementations, the main heatsink 1022 isconfigured to couple to the speaker assembly 904 (e.g., with the mainboard 1016 in between). In some implementations, the main heatsink 1022is configured to dissipate heat from the speaker assembly 904 to thecasing 711. In some implementations, the main heatsink 1022 is composedof a thermally-conductive material (e.g., magnesium).

In some implementations, the main board 1016 and the speaker assembly904 are thermally isolated from the image sensor assembly 902. Thermallyde-coupling the main board 1016 from the image sensor assembly 902prevents heat generated by the main board 1016 from interfering with theimage sensor assembly 902. In accordance with some implementations, heatgenerated by the front of the main board 764 is transferred to the mainheatsink 1022 to the thermal material 1018 and dissipated outside of thecamera via the casing 711 (e.g., the sides of the casing). In accordancewith some implementations, heat generated by the back of the main board1016 is transferred to the speaker assembly 904 and dissipated outsideof the camera via the casing 711.

In some implementations, the bottom seal 1010 is configured to inhibitwater from entering an interior of the camera assembly 118 from the baseassembly 704. In some implementations, the speaker seal 1004 isconfigured to inhibit water from entering an interior of the cameraassembly 118. In some implementations, the speaker seal 1004 isconfigured to acoustically and/or hermetically seal the speaker assembly904. In some implementations, the microphone membrane 1006 is configuredto inhibit water from entering an interior of the camera assembly 118via the microphone aperture 713. In some implementations, the microphonemembrane 1006 is configured to enable air to flow from an interior ofthe camera assembly 118 to the environment. For example, the membrane1006 is configured to equalize internal and external pressure of thecamera assembly by enabling the release of air through the microphoneaperture 713.

In some implementations, the camera assembly 118 includes one or moreforward-facing microphones as well as microphone 1008. In someimplementations, the microphone 1008 is operated in conjunction with theforward-facing microphones to determine directionality and/or locationof incoming sounds.

FIGS. 11A-11C are additional component views illustrating arepresentative camera assembly in accordance with some implementations.FIGS. 11A-11C show various perspective views of the front face 706 andimage sensor assembly 902. As shown in FIGS. 11A-11C, the cameraassembly 118 includes the image sensor assembly 902, the sensor pressurematerial 1030 (e.g., pressure foam), the sensor pressure plate 1028, thesensor heatsink 1026, the sensor shielding 1032, and a reset mechanism1116 corresponding to reset aperture 1117 in the front face 706. In someimplementations, the reset mechanism 1116 enables a user of the camera118 to perform a factory reset. In some implementations, the resetmechanism 1116 includes one or more components (e.g., a membrane) toinhibit water from entering an interior of the camera assembly 118.

As shown in FIGS. 11A-11C, the camera assembly 118 also includes thefront face 706, a plurality of lenses 1110 corresponding to a pluralityof infrared (IR) illuminators 1112 (e.g., IR LEDs), athermally-conductive mount 1108, IR illuminators 1112, microphones 1114(e.g., flex microphones), a light guide 1106, and the illuminatorassembly 1036. In some implementations, the thermally-conductive mount1108 is composed of plastic and/or nylon. In some implementations, thethermally-conductive mount 1108 is configured to couple illuminatorassembly 1036 to the front face 706. In some implementations, thethermally-conductive mount 1108 is configured to transfer heat fromilluminator assembly 1036 to the front face 706. In someimplementations, the thermally-conductive mount 1108 is configured totransfer heat from the IR illuminators 1112 to the front face 706. Insome implementations, the thermally-conductive mount 1108 is configuredto couple IR illuminators 1112 and the lenses 1110 to the front face706. In some implementations, the thermally-conductive mount 1108 iscomposed of a thermally-conductive plastic. In some implementations, thethermally-conductive mount 1108 is composed of a plastic infused withmetal to assist with heat transfer from the illuminators to the frontface 706.

In some implementations, the IR illuminators 1112 are configured to beindependently operated. In some implementations, subsets of the IRilluminators 1112 are utilized during particular modes of operation ofthe camera assembly 118. For example, subsets of the IR illuminators1112 are used to perform depth mapping of the scene, or to relay IRcommands to external devices.

In some implementations, the front face 706 includes a first element(e.g., a glass or plastic lens) that resides in front of the imagesensor and a second element (e.g., a glass or plastic lens) that residesin front of the illuminators (e.g., between the first element and theperiphery of the camera 118). In some implementations, the secondelement has a concave shape.

In some implementations, the front face 706 includes a cover glasshaving a thickness of 1 mm, or approximately 1 mm. In someimplementations, a light absorbing coating (e.g., a film or ink) andanti-reflective coating is added onto the rear of the front face 706 toprevent the light scattering. In some implementations, the coatingcomprises a smooth, matte ink that is light absorbing across allwavelengths of light. In some implementations, the front face 706includes a silkscreen logo. In some implementations, a first section ofthe front face 706 (e.g., a section that does not correspond to eitherthe image sensors or the illuminators) is coated with an opaque filmadapted to absorb visible and IR light. In some implementations, thefilm is an ink. In some implementations, second sections of the frontface 706 (e.g., corresponding to the IR illuminators 1112) are coatedwith an IR transparent film adapted to absorb visible light (e.g., isopaque or semi-opaque to visible light). In some implementations, thirdsections of the front face 706 are coated with a film that issemi-transparent (e.g., semi-transparent to IR and/or visible light). Insome implementations, the third sections correspond to a statusilluminator and/or an ambient light sensor. In some implementations, thefront face 706 is coated with an anti-reflection coating. For example,the front face 706 is coated first with the thin films then with theanti-reflection coating on top of the thin films. In someimplementations, the coatings are applied to the inner surface of thefront face 706. In some implementations, at least one of the coatings isapplied to the outer surface of the front face 706. In someimplementations, the front face 706 has an anti-reflection coatingapplied to both the inner and outer surfaces. In some implementations,the front face 706 includes an opaque coating to prevent, orsubstantially prevent, light from the illuminator assembly 1036 fromentering the image sensor.

In some implementations, one or more of the coatings comprise a smoothink adapted to absorb, not scatter, light. For example, an opaque inkadapted to absorb visible and IR light. In some implementations, one ormore of the coatings are adapted to absorb at least 99% of the light.For example, the opaque coating is adapted to absorb at least 99% ofvisible and IR light. In some implementations, one or more of thecoatings comprise a rough ink adapted to scatter light. In someimplementations, one or more of the coatings are applied via vapordeposition. In some implementations, one or more of the coatings areapplied via thin film deposition. In some implementations, one or moreof the coatings are applied via a pattern printing process. In someimplementations, one or more of the coatings are applied via a spray-onprocess. In some implementations, the one or more coatings and/or thesilk screen are applied utilizing an in-mold labeling process.

In some implementations, the lenses 1110 comprise toroidal lensesconfigured to distribute light from the IR illuminators 1112. In someimplementations, the lenses 1110 are adapted to improve efficiency ofthe IR illuminators 1112. The lenses 1110 are particularly importantwhen using IR illuminators having a wavelength that is not optimal forthe image sensor, since more intensity is needed in order to illuminatethe scene for the image sensor. In some implementations, the lenses 1110are adapted to prevent hot spots in the scene due to overlappingillumination from multiple IR illuminators. In some implementations, thelenses 1110 are adapted to direct and/or restrict the illumination fromthe IR illuminators to the portion of a scene captured by the imagesensor. For example, when the image sensor is adapted to capture a 16:9rectangular portion of the scene the lenses 1110 are adapted to providesubstantially uniform illumination in that portion and/or substantiallyno illumination outside of that portion. In some implementations, thelenses 1110 are shaped and/or positioned so as to provide substantiallyuniform illumination in that portion and substantially no illuminationoutside of that portion. In some implementations, the lenses 1110 areshaped and/or positioned so as to minimize overlap between IRilluminators.

In some implementations, the camera 118 includes a plurality of lenses1110, each corresponding to particular IR illuminator. For example, thecamera 118 includes four IR illuminators 1112 and four lenses 1110. Insome implementations, the lenses 1110 are configured such that the IRillumination from IR illuminators corresponding to the multiple lenses1110 is directed to provide substantially uniform illumination in aportion of a scene corresponding to the camera's field of view, and/orsubstantially no illumination outside of that portion. In someimplementations, the camera's image sensor is adapted to capture wideangle images (e.g., a fisheye view). In some implementations, the lenses1110 are configured to provide substantially uniform illumination overthe wide angle field of view.

In some implementations, the image sensor is configured to capture IRlight (e.g., IR light having a wavelength of 940 nm or 850 nm). In someimplementations, the IR light is converted (e.g., at the camera 118) towhite light for display to a user. In some implementations, the IRilluminators 1112 consist of four IR LEDs. In some implementations, thewavelength of the IR illuminators 1112 is adjusted to be further fromthe visible spectrum. For example, the wavelength of the IR illuminatorsis adjusted to 940 nm rather than 850 nm. Adjusting the IR illuminatorsto be further from the visible spectrum of light means that the IRillumination from the illuminators is less visible (or invisible) to thehuman eye. Therefore it is important that the IR illuminators are usedas efficiently as possible. For example, the IR illuminators areconfigured to only illuminate the portion of the scene that is capturedby the image sensor.

In some implementations, the image sensor has a rectangular field ofview corresponding to +/−32 degrees vertical and +/−56 horizontal. Insome implementations, the IR illuminators 1112 are configured to emitlight in a hemispherical pattern. Therefore, there is a need to directand shape the light from the IR illuminators to illuminate the imagesensor's field of view, while minimizing illumination outside of thefield of view and overlap between IR illuminators causing hot spots inthe sensed image.

In some implementations, the lenses 1110 are configured to direct andshape the light from the IR illuminators to illuminate the imagesensor's field of view, while minimizing illumination outside of thefield of view and overlap between IR illuminators causing hot spots inthe sensed image. In some implementations, the lenses 1110 are eachconfigured to shape the IR light from the IR illuminators to correspondto the field of view of the camera 118 (e.g., of an image sensor of thecamera 118). In some implementations, the lenses 1110 and theilluminators 1112 are positioned to minimize overlap in illuminationbetween the IR illuminators 1112. In some implementations, the lenses1110 are positioned such that illumination from the IR illuminators 1112is substantially uniform across the field of view of the image sensor.In some implementations, the lenses 1110 are positioned so as to provideincreased illumination (e.g., 1.2, 1.5, or 2 times the illumination) inthe center of the field of view of the camera.

In some implementations, the lenses 1110 are configured to optimizeenergy distribution from the IR illuminators in the field of view of thecamera. In some implementations, the lenses 1110 are configured tomaximize the energy from the IR illuminators within the field of view ofthe image sensor while minimizing the energy wasted outside of the imagesensor's field of view. In some implementations, the lenses 1110 areconfigured to shape the illumination from the IR illuminators such thatthe field of view of the camera is uniformly illuminated and areasoutside of the field of view of the camera are not substantiallyilluminated.

In some implementations, the IR illuminators 1112 comprise IR LEDshaving a wavelength of 940 nanometers. In some implementations, the IRilluminators 1112 comprise IR LEDs having a wavelength of 850nanometers. In some implementations, the image sensor for the camera 118is less sensitive to 940 nm light than it is to 850 nm light. Therefore,IR LEDs having a 940 nm wavelength cause less interference with theimage sensor than IR LEDs having an 850 nm wavelength.

In some implementations, the illuminator assembly 1036 comprises anilluminator board, a plurality of visible light illuminators (e.g., RGBLEDs), and circuitry for powering and/or operating the visible lightilluminators. In some implementations, the illuminator assembly 1036includes circuitry from powering and/or operating the IR illuminators1112.

In accordance with some implementations, the light guide 1106 includes afirst (inner) section and a second (outer) section. In someimplementations, the inner section is comprised of structuralpoly-carbonite. In some implementations, the outer section istransparent or semi-transparent to visible light. In accordance withsome implementations, the illuminator assembly 1036 includes visiblelight illuminators (e.g., RGB LEDs) and an ambient light sensor. In someimplementations, the illuminator assembly 1036 includes a plurality ofRGB LEDs (e.g., 6, 8, 9, or 12 LEDs) and the light guide 1106 includes acorresponding recess for each of the LEDs. In some implementations, thevisible light illuminators are configured to be controlled individually(e.g., controlled by the SoC 1322). In some implementations, eachilluminator corresponds to a portion of the light guide 1106. Forexample, the light guide 1106 includes a first portion corresponding toa first illuminator and a second portion corresponding to a secondilluminator. In some implementations, each illuminator is oriented in aclockwise manner and the light guide 1106 includes a correspondingportion extending from the location of the illuminator 1106 in aclockwise direction. In some implementations, each portion of the lightguide 1106 ends with, or is bounded by, a segmentor (e.g., alight-absorbing substance) that is adapted to prevent light from theilluminator from entering other portions of the light guide. In someimplementations, one or more surfaces of the light guide 1106 not facingthe front of the camera are coated or otherwise treated with a lightabsorbing substance (e.g., a black ink) to prevent light from theilluminators from exiting the light guide 1106 at that location.

In some implementations, the light guide 1106 is adapted to direct lightfrom the visible light illuminators out the face of the camera 118. Insome implementations, the light guide 1106 is adapted to prevent lightfrom the visible light illuminators from entering the image sensorassembly 902. In some implementations, the light guide 1106 is adaptedto spread the light from the visible light illuminators in asubstantially even manner. In some implementations, the light guide 1106is composed of a clear material. In some implementations, the lightguide 1106 is composed of a poly-carbonite material. In someimplementations, the light guide 1106 has a plurality of dimples torefract the light from the illuminators and prevent the light fromentering the image sensor assembly 902. In some implementations, thelight guide 1106 is adapted to provide more uniform color and lightoutput to a user from the illuminators. In some implementations, thelight guide 1106 includes a plurality of segments, each segmentcorresponding to a visible light illuminator. In some implementations,the light guide 1106 includes one or more light absorbing elements(e.g., black stickers) arranged between each segment to prevent lightleakage from one illuminator segment to another illuminator segment.

In some implementations, the light guide 1106 includes two or moresections (e.g., an inner section and an outer section). In someimplementations, the light guide 1106 is adapted to diffuse the lightfrom the visible light illuminators. In some implementations, the lightguide 1106 is adapted to direct the light from the illuminators towardthe front face 706. In some implementations, the illuminator assembly1036 (and corresponding elements such as the light guide 1106) causes acircular colored (or white) light to be emitted from the front of thecamera 118. In some implementations, the components and correspondinglight are circular and arranged around the periphery of the front face706. The resulting illumination ring optionally encircles all orsubstantially all elements of the camera 118, such as the image sensorassembly 902, the IR illuminators 1112, a ambient light sensor, a statusLED, and the microphones 1114. In other implementations, the resultingillumination ring is not around the periphery but rather at an innerdiameter, e.g., around only the image sensor assembly 902. In yet otherimplementations, the illuminators do not surround any front-facingelement of the camera 118. In some implementations, the illuminators arearranged in a non-circular shape, such as a square, oval, or polygonalshape. In some implementations, the illuminators are not arranged on thefront of the device but rather a different surface of the device, suchas the bottom, top, sides, or back. In some implementations, multiplesuch illuminators and light-guiding components are arranged onto thesame or different surfaces of the camera 118.

The illuminator assembly 1036 (and corresponding elements) optionallyoperate to indicate a status of the camera 118, another device within oroutside of the smart home environment 100 (e.g., another devicecommunicatively coupled either directly or indirectly to the camera118), and/or the entire connected smart home environment 100 (e.g., asystem status). The illuminator assembly 1036 (and correspondingelements) optionally causes different colors and/or animations to bedisplayed to a user that indicate such different statuses.

For example, in the context of communicating camera 118 status, when thecamera 118 is booting for the first time or after a reset operation, thering may pulse blue once at a slow speed. When the camera 118 is readyto begin setup, the ring may breathe blue continually. When the camera118 is connected to a remote cloud service and provisioning is complete(i.e., the camera is connected to a user's network and account), thering may pulse green once. When there is a service connection and/orprovisioning failure, the ring may blink yellow at a fast speed. Whenthe camera 118 is being operated to facilitate two-way talk (i.e., audiois captured from the audio and communicated to a remote device foroutput by that remote device simultaneously with audio being capturedfrom the remote device and communicated to the camera 118 for output bythe camera 118), the ring may breathe blue continuously at a fast speed.When the camera 118 is counting down final seconds before a factoryreset, the ring may close on itself at a rate equal to the time untilreset (e.g., five seconds). When the camera 118 has been factory andwhile the setting are being erased the ring may rotate bluecontinuously. When there is insufficient power for the camera 118 thering may blink red continuously at a slow speed. The visual indicationsare optionally communicated simultaneously, concurrently, or separatelyfrom audio indications that signal to the user a same or supplementalmessage. For example, when the camera 118 is connected to a remote cloudservice and provisioning is complete (i.e., the camera is connected to auser's network and account), the ring may pulse green once and output anaudio message that “remote cloud service and provisioning is complete.”

Additionally or alternatively, the camera 118 may communicate the statusof another device in communication with the camera 118. For example,when a hazard detector 104 detects smoke or fire sufficient to alarm,the camera 118 may output a light ring that pulses red continuously at afast speed. When a hazard detector 104 detects smoke or fire sufficientto warn a user but not alarm, the camera 118 may output a light ringthat pulses yellow a number of times. When a visitor engages a smartdoorbell 106 the camera 118 may output a light ring depending on theengagement; e.g., if the smart doorbell 106 detects motion, the camera118 may output a yellow light ring, if a user presses a call button onthe smart doorbell 106, the camera 118 may output a green light ring. Insome implementations, the camera 118 may be communicatively coupled tothe doorbell 106 to enable audio communication therebetween, in whichcase an animation and/or color of the light ring may change depending onwhether the user is speaking to the visitor or not through the camera118 or another device.

Additionally or alternatively, the camera 118 may communicate thecumulative status of a number of network-connected devices in the smarthome environment 100. For example, a smart alarm system 122 may includeproximity sensors, window break sensors, door movement detectors, etc. Awhole home state may be determined based on the status of such aplurality of sensors/detectors. For example, the whole home state may besecured (indicating the premises is secured and ready to alarm),alarming (indicating a determination that a break-in or emergencycondition exists), or somewhere in between such as pre-alarming(indicating a determination that a break-in or emergency condition mayexist soon or unless some condition is satisfied). For example, thecamera 118 light ring may pulse red continuously when the whole homestate is alarming, may pulse yellow when the whole home state ispre-alarming, and/or may be solid green when the whole home state issecured. In some implementations, such visual indications may becommunicated simultaneously (or separately from) with audio indicationsthat signal to the user the same or supplemental message. For example,when the whole home state is alarming, the ring may pulse red once andoutput an audio message that indicates the alarm “alarm”. In someimplementations, the audio message may provide supplemental informationthat cannot be conveyed via the light ring. For example, when the wholehome state is alarming due to a basement window being broken, the audiomessage may be “alarm—your basement window has been broken.” For anotherexample, when a pre-alarm amount of smoke has been detected by a hazarddetector 104 located in the kitchen, the audio message may be“warning—smoke is detected in your kitchen.”

In some implementations, the camera 118 may also or alternatively have astatus LED. Such a status LED may be used to less-instructivelycommunicate camera 118, other device, or multiple device statusinformation. For example, the status light may be solid green duringinitial setup, solid green when streaming video and/or audio datanormally, breathing green when someone is watching remotely, solid greenwhen someone is watching remotely and speaking through the camera 118,and off when the camera 118 is turned off or the status LED is disabled.It should be appreciated that the status LED may be displayedsimultaneously with the light ring. For example, the status LED may besolid green during setup while the light ring breathes blue, until theend of setup when the device is connected to the service andprovisioning is complete whereby the status LED may continue to be solidgreen while the light ring switches to a single pulse green.

FIGS. 12A-12B are component views illustrating the speaker assembly 904in accordance with some implementations. As shown in FIGS. 12A-12B, thespeaker assembly 904 includes a connector 1202, a speaker lid 1204, aspeaker base 1208, a speaker driver 1206, and gaskets 1210, 1212. Insome implementations, the connector 1202 provides power to the speakerassembly and/or communicatively-couples the speaker assembly to the mainboard 1016 (e.g., the SoC 1322). In some implementations, the speakerlid 1204 is composed of a thermally-conductive material (e.g., metal).In some implementations, the speaker lid 1204 is configured to coupleto, and dissipate heat from, the main board 1016. In someimplementations, the speaker base 1208 is composed of athermally-insulating material (e.g., plastic).

In some implementations, the speaker driver 1206 includes a speakermembrane. In some implementations, the speaker membrane is configured toenable air to flow from an interior of the camera assembly 118 to theenvironment. For example, the speaker membrane is configured to equalizeinternal and external pressure of the camera assembly by enabling therelease of air through the speaker apertures 712. In someimplementations, the speaker membrane is configured to acoustically- andhermetically-seal the speaker assembly 904.

In some implementations, the speaker driver 1206 includes a waterproofmembrane configured to inhibit water from entering the speaker box 904and/or an interior of the camera 118. In some implementations, thespeaker lid 1204, speaker driver 1206, and speaker base 1208 areconfigured to couple together to acoustically- and hermetically-seal thespeaker assembly 904. In some implementations, the gaskets 1210 and 1212are configured to acoustically- and hermetically-seal the speakerassembly 904.

FIGS. 13A-13C are component views illustrating the main board 1016assembly in accordance with some implementations. FIG. 13A shows a firstside (e.g., a front-facing side) of the main board 1016, FIG. 13B showsa profile view of the main board, and FIG. 13C shows a second side ofthe main board (e.g., a rear-facing side).

As shown in FIG. 13A, the first side includes a first radio 1302 (e.g.,a BlueTooth-configured radio) with corresponding shielding 1302, asecond radio 1306 (e.g., a WiFi-configured radio), radio memories 1304,shielding 1310 for the second radio 1306 and the radio memories 1304,and shielding 1308.

In some implementations, the radio 1302 and/or the radio 1306 isconfigured for broadband (e.g., Wi-Fi, cellular, etc.) communications.In some implementations, the radio 1302 and/or the radio 1306 isconfigured for point-to-point (e.g., Bluetooth) communications. In someimplementations, the radio 1302 and/or the radio 1306 is configured formesh networking (e.g., Thread, Zigbee, ZWave, IEEE 15.4, etc.)communications. The radios 1302, 1306 are coupled to the antennas of theantenna ring 1024.

In some implementations, the main board 1016 also includes a connectorfor communicatively coupling the main board 1016 to the illuminatorassembly 1036, a connector for communicatively coupling the main board1016 to the image sensor assembly 902, a connector for communicativelycoupling the main board 1016 to the connector 714, a connector forcommunicatively coupling the main board 1016 to the speaker assembly904, and/or connectors for communicatively coupling the main board 1016to the antenna ring 1024 (e.g., communicatively coupling the radios 1302and 1306 to the antennas of the antenna ring). In some implementations,the connectors comprise flex connectors. For example, the connector forcommunicatively coupling the main board 1016 to the image sensorassembly 904 comprises a flex connector. In some implementations, theconnectors for communicatively coupling the main board 1016 to theantennas of the antenna ring comprise spring connectors (e.g., springfinger connectors). In some implementations, the first side includes oneor more connectors for communicatively-coupling with other components ofthe camera assembly 118 (e.g., for communicatively coupling with theimage sensor assembly 902 and/or the illuminator assembly 1036). In someimplementations, the first side includes one or more connectors (e.g.,spring connectors) for communicatively-coupling the first radio 1302 andthe second radio 1306 with the antenna ring 1024.

In some implementations, the shielding (e.g., shielding 1302, 1310,and/or 1308) comprises electromagnetic (EMI) shielding. In someimplementations, the EMI shielding is composed of aluminum, stainlesssteel, and/or an aluminum alloy. In some implementations, each shieldingis configured to enclose the components within the shielding. In someimplementations, each shielding includes walls and a cover. In someimplementations, a corresponding cover is configured to snap to thewalls shown in FIGS. 13A and 13C.

In some implementations, the shielding is configured to minimizeelectromagnetic interference (e.g., from outside sources or betweenvarious components such as between the radios 1302 and 1306). In someimplementations, the shielding is configured to substantially isolatethe corresponding electrical components from sources outside of theshielding.

In some implementations, the first side of the main board 1016 isthermally-coupled to the main heatsink 1022. In some implementations,each shielding is configured to transfer heat from the enclosedcomponents to the casing 711 (e.g., via the main heatsink 1022). In someimplementations, each shielding is configured to inhibit signalinterference between the enclosed components and components exterior tothe shielding.

As shown in FIG. 13C, the second side of the main board 1016 includesthe System-on-a-Chip (SoC) 1322, memory 1320 (e.g., including memory anda memory controller), shielding 1326 encasing the SoC 1322 and thememory 1320, and a power module 1324 (e.g., a power managementintegrated circuit (PMIC)). In some implementations, the shielding 1326comprises electromagnetic (EMI) shielding. In some implementations, theshielding 1326 is composed of aluminum, stainless steel, and/or analuminum alloy.

In some implementations, the second side of the main board 1016 isthermally-coupled to the speaker assembly 904. In some implementations,the shielding 1326 is configured to transfer heat from the SoC 1322 andthe memory 1320 to the casing 711 (e.g., via the speaker lid 1204). Insome implementations, the shielding 1326 is configured to inhibit signalinterference between the SoC 1322 and the memory 1320 and componentsexterior to the shielding. In some implementations, the shielding 1326,is adapted to substantially prevent electromagnetic interference withthe SoC 1322 and/or the memory controller 1320 from outside sources.

In some implementations, the top components encased in shielding (e.g.,the SoC 1322 and/or the memory chip 1320) is coated with a thermalsubstance (e.g., a putty or paste) to dissipate heat from the componentto the shielding. In some implementations, the thermal substance is incontact with the shielding after the shielding is affixed to main board1016. Thus, the thermal substance transfers heat from the correspondingcomponent (e.g., the SoC 1322) to the shielding (e.g., shielding 1326).

In accordance with some implementations, a camera assembly (e.g., cameraassembly 118) for deployment in a smart home environment (e.g., smarthome environment 100) comprises: (1) a housing (e.g., casing 711); (2)an image sensor encased in the housing and configured to captureactivity of the smart home environment (e.g., an image sensor of imagesensor assembly 902); (3) a wireless radio (e.g., radio 1302 and/orradio 1306) configured to transmit video frames captured by the imagesensor to an electronic device via a remote server; (4) at least oneinfrared transmitter (e.g., IR illuminator 112) configured toselectively illuminate the smart home environment; (5) one or morecircuit boards (e.g., main board 1016) encased in the housing, the oneor more circuit boards including at least one processor mounted thereon;and (6) a heating component (e.g., the active heating module of theimage sensor assembly 902) coupled to the image sensor, the heatingcomponent configured to continuously maintain the image sensor at atemperature above a threshold temperature while the image sensor iscapturing the activity of the smart home environment.

In some implementations, the camera assembly further includes aplurality of thermally-conductive components (e.g., the main heatsink1022 and the thermal material 1018) configured to passively conduct heatfrom the one or more circuit boards to the housing. In someimplementations, the plurality of thermally-conductive componentscomprises one or more components composed of metal. In someimplementations, the plurality of thermally-conductive componentscomprises one or more thermal pastes (e.g., the thermal material 1018).In some implementations, the heating component is connected to a metalclasp (e.g., sensor heatsink 1026) holding the image sensor to a frontface of the camera assembly. In some implementations, the heatingcomponent is in contact with the image sensor.

In some implementations, an electronic assembly includes: (1) a housing(e.g., casing 711); (2) a temperature-sensitive component encased in thehousing, the temperature-sensitive component having an associatedlow-temperature operating threshold and high-temperature operatingthreshold; (3) a plurality of thermally-conductive components (e.g.,sensor heatsink 1026 and front face 706) coupled totemperature-sensitive component, the plurality of thermally-conductivecomponents configured to maintain the temperature-sensitive component ata temperature below the high-temperature operating threshold bypassively conducting heat to the housing; and (4) a heating component(e.g., the active heating component of the image sensor assembly 902)coupled to the temperature-sensitive component, the heating componentconfigured to maintain the temperature-sensitive component at atemperature above the low-temperature operating threshold by selectivelyheating the temperature-sensitive component.

In some implementations, the camera assembly further includes aplurality of thermally-conductive components coupled to the one or morecircuit boards and the wireless radio (e.g., the main heatsink 1022 andthe thermal material 1018), the plurality of thermally-conductivecomponents configured to passively conduct heat from the one or morecircuit boards and the wireless radio to the housing.

In some implementations, the camera assembly further includes aplurality of thermally-insulating components separating the one or morecircuit boards and the wireless radio from the image sensor, theplurality of thermally-insulating components comprising one or moreplastic components and one or more air gaps. In some implementations,the plurality of thermally-insulating components comprises one or morecomponents composed of plastic. In some implementations, the pluralityof thermally-insulating components comprises one or more air gaps.

In some implementations, the image sensor comprises a fixed focus imagesensor. In some implementations, the image sensor comprises a 4 ksensor.

In some implementations, the camera assembly further includes: (1) atemperature sensor coupled to the image sensor; and (2) controlcircuitry configured to: (a) determine a temperature of the image sensorbased on data from the temperature sensor; and (b) set an operatingparameter of the heating component based on the determined temperature.In some implementations, the control circuitry is configured to optimizecamera sharpness by maintaining the image sensor at temperatures above athreshold temperature. In some implementations, the control circuitrycomprises the at least one processor and/or one or more controllers. Insome implementations, the temperature sensor is in contact with theimage sensor. In some implementations, the temperature sensor isconnected to a same circuit board as the image sensor. In someimplementations, the temperature sensor is connected to one of the oneor more circuit boards (e.g., the main board 1016).

In some implementations: (1) the control circuitry is further configuredto determine whether the temperature of the image sensor is less than apreset target temperature for the image sensor; and (2) setting theoperating parameter of the heating component based on the determinedtemperature comprises: (a) initiating an active heat transfer from theheating component to the image sensor in accordance with a determinationthat the temperature of the image sensor is less than the preset targettemperature; and (b) forgoing an active heat transfer from the heatingcomponent to the image sensor in accordance with a determination thatthe temperature of the image sensor is not less than the preset targettemperature. In some implementations, the preset target temperature isin the middle of a band of optimal operating temperatures for the imagesensor. In some implementations, the preset target temperature is aminimum optimal operating temperature for the image sensor (e.g., aminimum temperature that doesn't negatively impact a focus of the imagesensor).

In some implementations, the control circuitry is further configured tomanage operation of the one or more additional components so as tomaintain the image sensor at temperatures below a high-temperaturethreshold, one or more additional components including one or more of:(1) a system-on-a-chip (e.g., SoC 1322); (2) a speaker assembly (e.g.,speaker assembly 904); (3) a power conversion assembly; and (4) acommunications assembly (e.g., antenna ring 1024 and/or radios 1302 and1306). In some implementations, managing operation of the one or moreadditional components includes minimizing or restricting operation ofthe components in accordance with a determination that a temperature ofthe camera assembly exceeds a particular threshold temperature. In someimplementations, the power conversion assembly is configured to convertAC power to DC power. In some implementations, the communicationsassembly comprises one or more wireless antennas and one or morewireless radios. In some implementations, the system-on-a-chip includesthe control circuitry.

In some implementations: (1) the camera assembly further includes one ormore additional components, including one or more of: (a) asystem-on-a-chip (e.g., SoC 1322); (b) a speaker assembly (e.g., speakerassembly 904); (c) a power conversion assembly; and (d) a communicationsassembly; and (2) the plurality of thermally-conductive components arefurther configured to passively conduct heat from the one or moreadditional components to the housing. In some implementations, theplurality of thermally-conductive components is further configured topassively conduct heat away from the image sensor (e.g., the pluralityof thermally-conductive components are thermally-isolated orthermally-insulated from the image sensor).

In some implementations, the camera assembly further includes a secondplurality of thermally-conductive components coupled to the image sensor(e.g., the sensor heatsink 1026), the second plurality of thermallyconductive components configured to passively conduct heat from theimage sensor to a front face (e.g., front face 706) of the cameraassembly. In some implementations, the front face comprises a concaveface configured to reduce water and/or light interference on the frontface. In some implementations, the front face is waterproof. In someimplementations, the second plurality of thermally-conductive componentsis thermally-insulated from the first plurality of thermally-conductivecomponents (e.g., via one or more air gaps).

In some implementations, the second plurality of thermally-conductivecomponents is further configured to inhibit interference between theimage sensor and one or more antennas of the camera assembly (e.g., theone or more antennas on the antenna ring 1024). In some implementations,the second plurality of thermally-conductive components comprises ametal shielding (e.g., the sensor heatsink 1026). In someimplementations, the heating component comprises a heat sticker coupledto the metal shielding.

In some implementations, the camera assembly further includes one ormore illuminators coupled to the second plurality ofthermally-conductive components. In some implementations, theilluminators include one or more RGB LEDs (e.g., illuminator assembly1036) and/or one or more IR LEDs (e.g., the IR illuminators 1112). Insome implementations, the camera assembly further comprises a lightguide configured to direct light from the LEDs to the scene (e.g., thelight guide 1106).

In some implementations, the camera assembly further includes: (1) oneor more illuminators (e.g., the IR illuminators 1112); and (2) one ormore toroidal lens (e.g., the lenses 1110) configured to disperse lightfrom one or more illuminators to a scene in a field of view of thecamera assembly.

In some implementations, the housing includes one or more microphoneholes (e.g., the apertures 708, 710, and 713), and the camera assemblyfurther comprises: (1) one or more microphones (e.g., the microphones1114 and 1008) coupled to the one or more microphone holes; and (2) oneor more membranes (e.g., the membrane 1006) separating the one or moremicrophones from the one or more microphone holes, the one or moremembranes configured to prevent water from entering an interior of thehousing. In some implementations, at least one of the membranes isfurther configured to equalize internal and external air pressure of thecamera assembly. In some implementations, the one or more membranes areconfigured to inhibit water entry by maintaining a higher pressureinside the camera assembly than the external pressure of the environs.In some implementations, the membranes (e.g., the microphone membrane1006 and/or the speaker membrane) are configured to prevent water flowinto an interior of the camera assembly when the camera assembly iswashed or sprayed with a hose.

In some implementations, the housing includes one or more speaker holes(e.g., the speaker apertures 712), and the camera assembly furthercomprises: (1) one or more speakers (e.g., the speaker assembly 904 withthe speaker driver 1206) coupled to the one or more speaker holes; and(2) one or more membranes separating the one or more speakers from theone or more speaker holes, the one or more membranes configured to (a)prevent water from entering an interior of the housing and (b) equalizeinternal and external air pressure.

In some implementations, the camera assembly further includes a speakerassembly (e.g., the speaker assembly 904), wherein the speaker assemblyis hermetically-sealed. In some implementations, the speaker assembly iscomposed of metal and plastic. In some implementations, the speakerassembly is acoustically-sealed.

In some implementations, the camera assembly further includes aplurality of antennas coupled to the one or more circuit boards via anantenna ring (e.g., the antenna ring 1024). In some implementations, theantenna ring is configured to electrically ground the antennas. In someimplementations, the antennas of the plurality of antennas areequidistance from one another. In some implementations, the antenna ringis configured to encircle the image sensor assembly (e.g., the imagesensor assembly 902).

In some implementations, the camera assembly further includes a boardcoupled to the antenna ring (e.g., illuminator assembly 1036) andconfigured to reduce interference between antennas of the plurality ofantennas. In some implementations, the board includes a plurality ofmetal clips (e.g., the connectors 1037) that contact the antenna ring atlocations between each of the plurality of antennas.

In accordance with some implementations, a method is performed at acamera assembly (e.g., the camera assembly 118) that includes a housing(e.g., the casing 711) encasing an image sensor, a wireless radio (e.g.,the radio 1302 or the radio 1306), and one or more circuit boards. Themethod includes: (1) capturing activity of a smart home environment viathe image sensor; (2) transmitting video frames captured by the imagesensor to a remote server via the wireless radio; (3) passivelyconducting heat from the one or more circuit boards and the wirelessradio to the housing via a first plurality of thermally-conductivecomponents of the camera assembly; and (4) while capturing the activityof the smart home environment: (a) monitoring a temperature of the imagesensor; and (b) selectively heating the image sensor to maintain theimage sensor at temperatures above a threshold temperature duringoperation of the image sensor.

In accordance with some implementations, the camera assembly 118 isadapted for outdoor use in a smart home environment. In someimplementations, the camera assembly 118 comprises: the housing 711; animage sensor assembly 902 positioned within the housing and having afield of view corresponding to a scene in the smart home environment;and the concave-shaped front face 706 positioned in front of the imagesensor such that light from the scene passes through the front faceprior to entering the image sensor. In some implementations, the frontface 706 includes: an inner section 707 corresponding to the imagesensor; and an outer section 709 between the housing and the innersection, the outer section having a concave shape. In someimplementations, the front face 706 is configured to inhibit wateraccumulation on the front face while the camera assembly is oriented ina downward position. In some implementations, the concave shape promoteswater dripping from the housing in front of the front face, rather thanaccumulating on and rolling down the front face (e.g., when the frontface is facing toward the ground).

In some implementations, the configuration of the housing and the frontface is further configured to inhibit direct sunlight from entering theimage sensor. In some implementations, the housing and the front faceare symmetrical around a central axis. In some implementations, thefront face is further configured to inhibit water entry into the cameraassembly. In some implementations, the front face includes the sealingring 1040 that prevents water entry while the front face is connected tothe housing 711.

In some implementations, the inner section 707 is substantially flat. Insome implementations, the outer section 709 is composed of a plastic;and the inner section 707 is composed of a glass. In someimplementations, both sections are glass and/or plastic. In someimplementations, the inner section is bonded to the outer section via awaterproof adhesive.

In some implementations, the inner section is separated from the outersection by a bounding component, the bounding component configured toinhibit transmission of light from the outer section to the innersection. In some implementations, the camera assembly further includesan anti-reflection coating applied to the front face 706. In someimplementations, the anti-reflection coating is applied to an innersurface of the front face.

In some implementations, the camera assembly 118 further comprising oneor more infrared (IR) illuminators 1112 configured to selectivelyilluminate the scene. In some implementations, the front face 706 ispositioned in front of the one or more IR illuminators 1112 such thatlight from the one or more IR illuminators is directed through the frontface.

In some implementations, the inner section 707 is substantiallytransparent to IR and visible light; and at least a portion of the outersection 709 is coated with a thin film that is substantially transparentto IR light and substantially opaque to visible light.

In some implementations, the one or more IR illuminators 1112 areconfigured to emit a particular wavelength of IR light (e.g., 850 nm);and at least a portion of the outer section 709 of the front face iscoated with a thin film that is substantially transparent to theparticular wavelength of IR light and substantially opaque to visiblelight.

In some implementations, the camera assembly further includes a mountingassembly (e.g., sensor heatsink 1026) configured to thermally couple theimage sensor to the front face such that heat from the image sensor isdissipated to the front face.

In some implementations, the camera assembly further includes a visibleilluminator (e.g., on the illuminator assembly 1036) configured toconvey status information of the camera assembly to a user; and thefront face is positioned in front of the visible illuminator such thatlight from the visible illuminator is directed through the outersection. In some implementations, the outer section includes a portioncorresponding the visible illuminator, the portion being at leastsemi-transparent to visible light.

In some implementations, the camera assembly further includes an ambientlight sensor configured to detect ambient light corresponding to thescene; and the front face is positioned in front of the ambient lightsensor such that light from the scene passes through the outer sectionprior to entering the ambient light sensor. In some implementations, theouter section includes a portion corresponding the ambient light sensor,the portion being at least semi-transparent to visible light.

Although the implementations are described as including particularnumbers of components (e.g., 3 microphones, 3 antennas, 2 IRilluminators, etc.), these numbers are not intended to be limiting. Thenumber of these components is optionally varied, from zero or one tomany (e.g., 4, 6, or 10) in different implementations, as would beapparent to one skilled in the art based on technical, aesthetic, and/orbudgetary requirements and/or preferences.

For situations in which the systems discussed above collect informationabout users, the users may be provided with an opportunity to opt in/outof programs or features that may collect personal information (e.g.,information about a user's preferences or usage of a smart device). Inaddition, in some implementations, certain data may be anonymized in oneor more ways before it is stored or used, so that personallyidentifiable information is removed. For example, a user's identity maybe anonymized so that the personally identifiable information cannot bedetermined for or associated with the user, and so that user preferencesor user interactions are generalized (for example, generalized based onuser demographics) rather than associated with a particular user.

Although some of various drawings illustrate a number of logical stagesin a particular order, stages that are not order dependent may bereordered and other stages may be combined or broken out. While somereordering or other groupings are specifically mentioned, others will beobvious to those of ordinary skill in the art, so the ordering andgroupings presented herein are not an exhaustive list of alternatives.Moreover, it should be recognized that the stages could be implementedin hardware, firmware, software or any combination thereof.

The foregoing description, for purpose of explanation, has beendescribed with reference to specific implementations. However, theillustrative discussions above are not intended to be exhaustive or tolimit the scope of the claims to the precise forms disclosed. Manymodifications and variations are possible in view of the aboveteachings. The implementations were chosen in order to best explain theprinciples underlying the claims and their practical applications, tothereby enable others skilled in the art to best use the implementationswith various modifications as are suited to the particular usescontemplated.

What is claimed is:
 1. A camera assembly for deployment in a smart homeenvironment, comprising: a housing; an image sensor encased in thehousing and configured to capture activity of the smart homeenvironment; a wireless radio configured to transmit video framescaptured by the image sensor to an electronic device via a remoteserver; at least one infrared transmitter configured to selectivelyilluminate the smart home environment; one or more circuit boardsencased in the housing, the one or more circuit boards including atleast one processor mounted thereon; and a heating component, directlyor indirectly, physically coupled to the image sensor, the heatingcomponent configured to continuously maintain the image sensor at atemperature above a threshold temperature while the image sensor iscapturing the activity of the smart home environment; wherein theheating component is attached to a sensor heatsink coupled to the imagesensor, is affixed to an image sensor board associated with the imagesensor, or is disposed directly in contact with the image sensor.
 2. Thecamera assembly of claim 1, wherein the image sensor comprises a fixedfocus image sensor.
 3. The camera assembly of claim 1, furthercomprising: one or more illuminators; and one or more toroidal lensconfigured to disperse light from one or more illuminators to a scene ina field of view of the camera assembly.
 4. The camera assembly of claim1, wherein the housing includes one or more speaker holes, furthercomprising: one or more speakers coupled to the one or more speakerholes; and one or more membranes separating the one or more speakersfrom the one or more speaker holes, the one or more membranes configuredto (a) prevent water from entering an interior of the housing and (b)equalize internal and external air pressure.
 5. The camera assembly ofclaim 1, further comprising a plurality of thermally-conductivecomponents coupled to the one or more circuit boards and the wirelessradio, the plurality of thermally-conductive components configured topassively conduct heat from the one or more circuit boards and thewireless radio to the housing.
 6. A camera assembly for deployment in asmart home environment, comprising: a housing; an image sensor encasedin the housing and configured to capture activity of the smart homeenvironment; a wireless radio configured to transmit video framescaptured by the image sensor to an electronic device via a remoteserver; at least one infrared transmitter configured to selectivelyilluminate the smart home environment; one or more circuit boardsencased in the housing, the one or more circuit boards including atleast one processor mounted thereon; a heating component coupled to theimage sensor, the heating component configured to continuously maintainthe image sensor at a temperature above a threshold temperature whilethe image sensor is capturing the activity of the smart homeenvironment; and a plurality of thermally-insulating componentsseparating the one or more circuit boards and the wireless radio fromthe image sensor, the plurality of thermally-insulating componentscomprising one or more plastic components and one or more air gaps. 7.The camera assembly of claim 6, further comprising a plurality ofthermally-conductive components coupled to the one or more circuitboards and the wireless radio, the plurality of thermally-conductivecomponents configured to passively conduct heat from the one or morecircuit boards and the wireless radio to the housing.
 8. The cameraassembly of claim 7, further comprising one or more additionalcomponents, including one or more of: a system-on-a-chip (SoC); aspeaker assembly; a power conversion assembly; and a communicationsassembly; and wherein the plurality of thermally-conductive componentsare further configured to passively conduct heat from the one or moreadditional components to the housing.
 9. The camera assembly of claim 7,wherein the plurality of thermally-conductive components are furtherconfigured to passively conduct heat away from the image sensor.
 10. Thecamera assembly of claim 6, further comprising a second plurality ofthermally-conductive components coupled to the image sensor, the secondplurality of thermally-conductive components configured to passivelyconduct heat from the image sensor to a front face of the cameraassembly.
 11. The camera assembly of claim 10, wherein the secondplurality of thermally-conductive components is further configured toinhibit interference between the image sensor and one or more antennasof the camera assembly.
 12. The camera assembly of claim 10, furthercomprising one or more illuminators coupled to the second plurality ofthermally-conductive components.
 13. A camera assembly for deployment ina smart home environment, comprising: a housing; an image sensor encasedin the housing and configured to capture activity of the smart homeenvironment; a wireless radio configured to transmit video framescaptured by the image sensor to an electronic device via a remoteserver; at least one infrared transmitter configured to selectivelyilluminate the smart home environment; one or more circuit boardsencased in the housing, the one or more circuit boards including atleast one processor mounted thereon; a heating component coupled to theimage sensor, the heating component configured to continuously maintainthe image sensor at a temperature above a threshold temperature whilethe image sensor is capturing the activity of the smart homeenvironment; a temperature sensor coupled to the image sensor; andcontrol circuitry configured to: determine a temperature of the imagesensor based on data from the temperature sensor; and set an operatingparameter of the heating component based on the determined temperature.14. The camera assembly of claim 13, wherein the control circuitry isfurther configured to determine whether the temperature of the imagesensor is less than a preset target temperature for the image sensor;and wherein setting the operating parameter of the heating componentbased on the determined temperature comprises: initiating an active heattransfer from the heating component to the image sensor in accordancewith a determination that the temperature of the image sensor is lessthan the preset target temperature; and forgoing an active heat transferfrom the heating component to the image sensor in accordance with adetermination that the temperature of the image sensor is not less thanthe preset target temperature.
 15. The camera assembly of claim 13,wherein the housing includes one or more microphone holes, and thecamera assembly further comprises: one or more microphones coupled tothe one or more microphone holes; and one or more membranes separatingthe one or more microphones from the one or more microphone holes, theone or more membranes configured to prevent water from entering aninterior of the housing.
 16. The camera assembly of claim 15, wherein atleast one of the membranes is further configured to equalize internaland external air pressure.
 17. The camera assembly of claim 13, whereinthe housing includes one or more speaker holes, and the camera assemblyfurther comprises: one or more speakers coupled to the one or morespeaker holes; and one or more membranes separating the one or morespeakers from the one or more speaker holes, the one or more membranesconfigured to (a) prevent water from entering an interior of the housingand (b) equalize internal and external air pressure.
 18. The cameraassembly of claim 13, further comprising one or more additionalcomponents, wherein the one or more additional components include one ormore of: a system-on-a-chip (SoC); a speaker assembly; a powerconversion assembly; and a communications assembly; and wherein aplurality of thermally-conductive components is configured to passivelyconduct heat from the one or more additional components to the housing.19. A camera assembly for deployment in a smart home environment,comprising: a housing; an image sensor encased in the housing andconfigured to capture activity of the smart home environment; a wirelessradio configured to transmit video frames captured by the image sensorto an electronic device via a remote server; at least one infraredtransmitter configured to selectively illuminate the smart homeenvironment; one or more circuit boards encased in the housing, the oneor more circuit boards including at least one processor mounted thereon;a heating component coupled to the image sensor, the heating componentconfigured to continuously maintain the image sensor at a temperatureabove a threshold temperature while the image sensor is capturing theactivity of the smart home environment; and a plurality of antennascoupled to the one or more circuit boards via an antenna ring.
 20. Thecamera assembly of claim 19, further comprising a board coupled to theantenna ring and configured to reduce interference between antennas ofthe plurality of antennas.
 21. The camera assembly of claim 19, furthercomprising a plurality of thermally-conductive components coupled to theone or more circuit boards and the wireless radio, the plurality ofthermally-conductive components configured to passively conduct heatfrom the one or more circuit boards and the wireless radio to thehousing.
 22. The camera assembly of claim 19, wherein a plurality ofthermally-conductive components is configured to passively conduct heataway from the image sensor.
 23. The camera assembly of claim 19, whereinthe housing includes one or more microphone holes, and the cameraassembly further comprises: one or more microphones coupled to the oneor more microphone holes; and one or more membranes separating the oneor more microphones from the one or more microphone holes, the one ormore membranes configured to prevent water from entering an interior ofthe housing.
 24. The camera assembly of claim 23, wherein at least oneof the membranes is further configured to equalize internal and externalair pressure.
 25. A method, comprising: at a camera assembly comprisinga housing encasing an image sensor, a heating component, a wirelessradio, and one or more circuit boards: capturing activity of a smarthome environment via the image sensor; transmitting video framescaptured by the image sensor to a remote server via the wireless radio;passively conducting heat from the one or more circuit boards and thewireless radio to the housing via a first plurality ofthermally-conductive components of the camera assembly; and whilecapturing the activity of the smart home environment: monitoring atemperature of the image sensor; and selectively heating the imagesensor by the heating component to maintain the image sensor attemperatures above a threshold temperature during operation of the imagesensor, wherein the heating component is, directly or indirectly,physically coupled to the image sensor; wherein the heating component isattached to a sensor heatsink coupled to the image sensor, is affixed toan image sensor board associated with the image sensor, or is disposeddirectly in contact with the image sensor.
 26. The method of claim 25,further comprising passively conducting heat from the image sensor to afront face of the camera assembly via a second plurality ofthermally-conductive components.
 27. The method of claim 25, furthercomprising selectively illuminating a scene within a field of view ofthe camera assembly via one or more illuminators of the camera assembly.28. The method of claim 25, wherein the camera assembly furthercomprises: one or more illuminators; and one or more toroidal lensconfigured to disperse light from one or more illuminators to a scene ina field of view of the camera assembly.
 29. The method of claim 25,wherein the housing includes one or more speaker holes, and the cameraassembly further comprises: one or more speakers coupled to the one ormore speaker holes; and one or more membranes separating the one or morespeakers from the one or more speaker holes, the one or more membranesconfigured to (a) prevent water from entering an interior of the housingand (b) equalize internal and external air pressure.
 30. The method ofclaim 25, wherein the camera assembly further comprises a plurality ofthermally-conductive components coupled to the image sensor, and theplurality of thermally-conductive components is configured to passivelyconduct heat from the image sensor to a front face of the cameraassembly.